XCKU19P-1FFVJ1760E

The XCKU19P-1FFVJ1760E chip model is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It is a mid-range FPGA with a Kintex UltraScale+ architecture. It has a total of 1.76 million logic cells and 1.76 million flip-flops. It has a total of 8,192 DSP slices, with each slice containing 18×18 multipliers. It also has 4,096 RAM blocks, with each block having up to 512 Kbits of memory.

The chip has a total of 1,536 I/O pins, with each pin having a voltage range of 1.2V to 3.3V. It also has a total of 8,192 I/O banks, with each bank having up to 8 I/O pins. It has a total of 16 GTH transceivers, with each transceiver having up to 28.5 Gbps of bandwidth. The chip has a total of 8,192 CLB slices, with each slice having up to 4 lookup tables and 8 slices.

The chip is suitable for a variety of applications, including networking, communications, data centers, high-performance computing, and embedded systems. It can be used for a variety of tasks, such as signal processing, image processing, video processing, and encryption. It is also suitable for use in automotive, aerospace, and industrial applications.

Overall, the XCKU19P-1FFVJ1760E chip model is a powerful and versatile FPGA with a wide range of features and applications. It is suitable for a variety of tasks and applications, and can be used for a variety of tasks, such as signal processing, image processing, video processing, and encryption.