XCKU19P-2FFVB2104E

The XCKU19P-2FFVB2104E is a high-performance FPGA chip from Xilinx. It is a member of the Kintex UltraScale+ family and is based on the UltraScale+ architecture. It is suitable for a wide range of applications such as aerospace, defense, industrial, automotive, medical, and communications.

The XCKU19P-2FFVB2104E chip has a total of 19,200 logic cells, 2,304 DSP slices, and 4,096 Kb of block RAM. It also features up to 28.8 Gbps transceivers and up to 4,096 I/O pins. It has a power consumption of up to 23 W, and a maximum operating temperature of 0 to 85°C. It is packaged in a flip-chip ball grid array (FCBGA) with a pitch of 0.8 mm.

The XCKU19P-2FFVB2104E chip is designed to provide high performance and low power consumption. It is capable of executing complex algorithms and handling large data sets quickly and efficiently. It can be used for applications such as data center acceleration, machine learning, video processing, and embedded vision. It is also suitable for high-speed networking, aerospace, and defense applications.

In summary, the XCKU19P-2FFVB2104E is a high-performance FPGA chip from Xilinx. It has 19,200 logic cells, 2,304 DSP slices, and 4,096 Kb of block RAM. It is suitable for a wide range of applications such as aerospace, defense, industrial, automotive, medical, and communications. It is capable of executing complex algorithms and handling large data sets quickly and efficiently.