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BGA, BGA672,26X26,40

10AX032E3F27I2LG ECAD Model

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10AX032E3F27I2LG Attributes

Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 320000
Number of CLBs 11990
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 11990 CLBS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX032E3F27I2LG Overview

The chip model 10AX032E3F27I2LG is a high-performance, low-power chip designed for digital signal processing, embedded processing, and image processing. This chip model is suitable for a wide range of applications, from consumer electronics to industrial automation. It is also suitable for the development of future intelligent robots.

The 10AX032E3F27I2LG chip model has a 32-bit architecture with a maximum clock frequency of 2.7 GHz. It has a maximum memory capacity of 2GB, and supports both DDR4 and LPDDR4 memory. It has an integrated graphics processing unit (GPU) with a maximum of 256 cores, and a high-speed communication interface that supports up to 8 lanes of PCIe Gen3.0. It also supports multiple HD video formats, including 4K@60Hz and 8K@30Hz.

In terms of design requirements, the 10AX032E3F27I2LG chip model requires the use of HDL language. It also requires a certain level of understanding of the hardware design and verification process, as well as knowledge of the hardware/software interface. In addition, the chip model is designed to be compatible with a wide range of operating systems, including Windows, Linux, and Android.

In terms of actual case studies, the 10AX032E3F27I2LG chip model has been used in a variety of applications, such as facial recognition systems, autonomous driving systems, and unmanned aerial vehicles. In these applications, the chip model has demonstrated its ability to process large amounts of data quickly and accurately.

In terms of precautions, it is important to note that the 10AX032E3F27I2LG chip model is not suitable for applications that require high-power or high-frequency operation. It is also important to ensure that the chip model is properly cooled, as it can become unstable if it is exposed to high temperatures.

The 10AX032E3F27I2LG chip model can be applied to the development and popularization of future intelligent robots. The chip model has the necessary processing power and communication interface to enable robots to interact with their environment. In addition, the chip model can be used to develop algorithms for autonomous navigation, object recognition, and decision-making. To use the model effectively, technical talents with experience in hardware design and verification, as well as software development, will be needed.

4,680 In Stock

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Unit Price: $1,176.808
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,094.4314 $1,094.4314
10+ $1,082.6634 $10,826.6336
100+ $1,023.8230 $102,382.2960
1000+ $964.9826 $482,491.2800
10000+ $882.6060 $882,606.0000
The price is for reference only, please refer to the actual quotation!

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