EP1SGX25CF672I7
EP1SGX25CF672I7 ECAD Model
EP1SGX25CF672I7 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Number of Inputs | 455 | |
| Number of Outputs | 455 | |
| Number of Logic Cells | 25660 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.5,1.5/3.3 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 135 °C | |
| Operating Temperature-Min | -65 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | ALTERA CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.A | |
| HTS Code | 8542.39.00.01 | |
| Package Description | BGA, BGA672,26X26,40 |
EP1SGX25CF672I7 Datasheet Download
EP1SGX25CF672I7 Overview
The chip model EP1SGX25CF672I7 is a high-performance FPGA chip developed by Altera Corporation. It is designed with a number of advanced features to meet the needs of high-performance digital signal processing, embedded processing, image processing and other applications. It is equipped with a high-performance processor core and a large number of embedded memories and logic blocks, making it an ideal choice for high-performance applications.
The EP1SGX25CF672I7 chip model is designed to be used in conjunction with the HDL language, which is a powerful language for designing digital systems. This allows for the development of complex systems with a high degree of accuracy and reliability. Furthermore, the chip model is designed to be highly scalable and can be used in a variety of applications. This makes it a great choice for those who need to design high-performance and reliable systems.
The EP1SGX25CF672I7 chip model has a number of advantages such as high performance, low power consumption, and scalability. It also has a large number of embedded memories and logic blocks, making it an ideal choice for high-performance applications. The chip model is also designed to be highly reliable and is expected to be in high demand in the coming years.
The original design intention of the chip model EP1SGX25CF672I7 was to provide a reliable, high-performance solution for a variety of applications. It is designed to be highly scalable and can be used in a variety of applications. It is also designed to be used in conjunction with the HDL language, which is a powerful language for designing digital systems. Furthermore, the chip model is designed to be highly reliable and is expected to be in high demand in the coming years.
The EP1SGX25CF672I7 chip model can be used in a variety of applications and can be upgraded for future use. It is also possible to use the chip model for advanced communication systems, as it is designed to be highly reliable and has a high degree of accuracy and reliability. Furthermore, the chip model is designed to be highly scalable and can be used in a variety of applications. This makes it a great choice for those who need to design high-performance and reliable systems.
In conclusion, the EP1SGX25CF672I7 chip model is a high-performance FPGA chip developed by Altera Corporation. It is designed with a number of advanced features to meet the needs of high-performance digital signal processing, embedded processing, image processing and other applications. It is equipped with a high-performance processor core and a large number of embedded memories and logic blocks, making it an ideal choice for high-performance applications. It is also designed to be used in conjunction with the HDL language, which is a powerful language for designing digital systems. Furthermore, the chip model is designed to be highly reliable and is expected to be in high demand in the coming years. It can also be upgraded for future use and can be used in advanced communication systems.
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