EP1SGX40DF1020I5N
EP1SGX40DF1020I5N ECAD Model
EP1SGX40DF1020I5N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 624 | |
Number of Outputs | 624 | |
Number of Logic Cells | 41250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.5,1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1020 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 135 °C | |
Operating Temperature-Min | -65 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 1020 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1020,32X32,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 33 mm | |
Length | 33 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 33 X 33 MM, 1 MM PITCH, LEAD FREE, FBGA-1020 | |
Pin Count | 1020 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.A |
EP1SGX40DF1020I5N Datasheet Download
EP1SGX40DF1020I5N Overview
The chip model EP1SGX40DF1020I5N is a powerful, low-cost and low-power solution for a wide range of applications. It is a Field Programmable Gate Array (FPGA) with a 40 nm process technology, which provides high-speed, low-power, and low-cost performance. This FPGA is suitable for a variety of applications such as embedded systems, automotive, industrial, and medical.
The EP1SGX40DF1020I5N chip model offers a wide range of features and benefits, including high-speed performance, low-power consumption, and low-cost production. It is designed to be compatible with the latest technologies, such as Ethernet, USB, and PCIe. It also supports a wide range of protocols, such as SATA, PCI Express, and USB 3.0. Moreover, it has an integrated power management system to reduce power consumption and improve system performance.
The EP1SGX40DF1020I5N chip model is expected to be widely used in the future as it offers a number of advantages over other chip models. It is expected to be used in a variety of applications, such as embedded systems, automotive, industrial, and medical. It is also expected to be used in the development of new technologies, such as 5G, artificial intelligence, and machine learning.
In terms of product design, the EP1SGX40DF1020I5N chip model offers a wide range of features and benefits. It has a built-in power management system to reduce power consumption and improve system performance. It also has a wide range of protocols and interfaces, such as Ethernet, USB, PCI Express, and SATA. Moreover, it is also designed to be compatible with the latest technologies, such as 5G, artificial intelligence, and machine learning.
In order to ensure the successful application of the EP1SGX40DF1020I5N chip model, it is important to consider the specific design requirements for the chip model. For example, the power management system should be designed to reduce power consumption and improve system performance. The protocols and interfaces should also be designed to be compatible with the latest technologies, such as 5G, artificial intelligence, and machine learning. Additionally, it is important to consider the safety and reliability of the chip model when designing the product.
In conclusion, the EP1SGX40DF1020I5N chip model is a powerful, low-cost and low-power solution for a wide range of applications. It is expected to be widely used in the future due to its advantages over other chip models. In order to ensure the successful application of the chip model, it is important to consider the specific design requirements for the chip model, as well as the safety and reliability of the product. Additionally, it is important to consider whether the application environment requires the support of new technologies, such as 5G, artificial intelligence, and machine learning.
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