EP1SGX40DF1020I5N
EP1SGX40DF1020I5N
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rohs
Altera

EP1SGX40DF1020I5N


EP1SGX40DF1020I5N
F53-EP1SGX40DF1020I5N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 33 X 33 MM, 1 MM PITCH, LEAD FREE, FBGA-1020
33 X 33 MM, 1 MM PITCH, LEAD FREE, FBGA-1020

EP1SGX40DF1020I5N ECAD Model


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EP1SGX40DF1020I5N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 624
Number of Outputs 624
Number of Logic Cells 41250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Power Supplies 1.5,1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1020
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 135 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 1020
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1020,32X32,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 33 X 33 MM, 1 MM PITCH, LEAD FREE, FBGA-1020
Pin Count 1020
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.2.A

EP1SGX40DF1020I5N Datasheet Download


EP1SGX40DF1020I5N Overview



The chip model EP1SGX40DF1020I5N is a powerful, low-cost and low-power solution for a wide range of applications. It is a Field Programmable Gate Array (FPGA) with a 40 nm process technology, which provides high-speed, low-power, and low-cost performance. This FPGA is suitable for a variety of applications such as embedded systems, automotive, industrial, and medical.


The EP1SGX40DF1020I5N chip model offers a wide range of features and benefits, including high-speed performance, low-power consumption, and low-cost production. It is designed to be compatible with the latest technologies, such as Ethernet, USB, and PCIe. It also supports a wide range of protocols, such as SATA, PCI Express, and USB 3.0. Moreover, it has an integrated power management system to reduce power consumption and improve system performance.


The EP1SGX40DF1020I5N chip model is expected to be widely used in the future as it offers a number of advantages over other chip models. It is expected to be used in a variety of applications, such as embedded systems, automotive, industrial, and medical. It is also expected to be used in the development of new technologies, such as 5G, artificial intelligence, and machine learning.


In terms of product design, the EP1SGX40DF1020I5N chip model offers a wide range of features and benefits. It has a built-in power management system to reduce power consumption and improve system performance. It also has a wide range of protocols and interfaces, such as Ethernet, USB, PCI Express, and SATA. Moreover, it is also designed to be compatible with the latest technologies, such as 5G, artificial intelligence, and machine learning.


In order to ensure the successful application of the EP1SGX40DF1020I5N chip model, it is important to consider the specific design requirements for the chip model. For example, the power management system should be designed to reduce power consumption and improve system performance. The protocols and interfaces should also be designed to be compatible with the latest technologies, such as 5G, artificial intelligence, and machine learning. Additionally, it is important to consider the safety and reliability of the chip model when designing the product.


In conclusion, the EP1SGX40DF1020I5N chip model is a powerful, low-cost and low-power solution for a wide range of applications. It is expected to be widely used in the future due to its advantages over other chip models. In order to ensure the successful application of the chip model, it is important to consider the specific design requirements for the chip model, as well as the safety and reliability of the product. Additionally, it is important to consider whether the application environment requires the support of new technologies, such as 5G, artificial intelligence, and machine learning.



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