EP3C25F256I8
EP3C25F256I8 ECAD Model
EP3C25F256I8 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 156 | |
| Number of Outputs | 156 | |
| Number of Logic Cells | 24624 | |
| Number of CLBs | 24624 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24624 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C25F256I8 Datasheet Download
EP3C25F256I8 Overview
The chip model EP3C25F256I8 is a powerful and versatile chip model that is suitable for a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. With its advanced features, the chip model EP3C25F256I8 is capable of handling complex tasks and providing users with an efficient and reliable solution for their needs.
The original design intention of the chip model EP3C25F256I8 is to provide users with a powerful and versatile chip model that can be used in a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. With its advanced features, the chip model EP3C25F256I8 is capable of handling complex tasks and providing users with an efficient and reliable solution for their needs.
The chip model EP3C25F256I8 has the potential to be upgraded in the future to meet the changing needs of users. With its advanced features, the chip model EP3C25F256I8 can be used in advanced communication systems and other applications that require the use of HDL language. The chip model EP3C25F256I8 is also capable of being used in the development and popularization of future intelligent robots, as it is powerful enough to handle complex tasks and provide users with an efficient and reliable solution for their needs.
In order to use the chip model EP3C25F256I8 effectively, users need to have a certain level of technical expertise in the HDL language. They should also have a basic understanding of digital signal processing, embedded processing, image processing, and other related topics. With the proper technical knowledge and expertise, users can effectively utilize the chip model EP3C25F256I8 to meet their needs and take advantage of its advanced features.
You May Also Be Interested In
656 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||