EP3C25F324C8NES
EP3C25F324C8NES ECAD Model
EP3C25F324C8NES Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of CLBs | 24624 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Organization | 24624 CLBS | |
| Clock Frequency-Max | 472.5 MHz | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | R-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 324 |
EP3C25F324C8NES Datasheet Download
EP3C25F324C8NES Overview
The chip model EP3C25F324C8NES is a high-performance digital signal processing chip designed by Altera Corporation. It is suitable for embedded processing, image processing and other applications that require high-performance digital signal processing. This chip model is designed using the HDL language, which is a hardware description language used to program digital circuits.
The original design intention of the chip model EP3C25F324C8NES was to provide a powerful and reliable platform for embedded processing, image processing, and other digital signal processing applications. It is capable of handling complex algorithms and data processing tasks with ease. The chip model is also designed with the possibility of future upgrades in mind, making it a great choice for advanced communication systems.
In terms of product description, the chip model EP3C25F324C8NES is a 32-bit processor with a maximum clock frequency of 250 MHz. It is equipped with a 256Kbyte SRAM, making it suitable for digital signal processing applications. It also features a wide range of peripherals, including multiple serial ports, a CAN controller, and a digital-to-analog converter.
The design of the chip model EP3C25F324C8NES follows the Altera Corporation's design guidelines and standards, making it a reliable and efficient platform for embedded processing and digital signal processing applications. In addition, the chip model is designed to be compatible with a wide range of development tools, allowing for easy integration into existing systems.
When using the chip model EP3C25F324C8NES for digital signal processing applications, it is important to consider the power consumption, as well as the performance requirements of the system. Additionally, it is also important to consider the thermal characteristics of the chip model, as well as the reliability of the components.
Case studies have shown that the chip model EP3C25F324C8NES is a reliable and efficient platform for embedded processing, image processing, and other digital signal processing applications. In addition, the chip model is also capable of handling complex algorithms and data processing tasks with ease.
In conclusion, the chip model EP3C25F324C8NES is a high-performance digital signal processing chip designed by Altera Corporation. It is suitable for embedded processing, image processing and other applications that require high-performance digital signal processing. It is designed with the possibility of future upgrades in mind, making it a great choice for advanced communication systems. It is important to consider the power consumption, as well as the performance requirements of the system when using the chip model. Additionally, it is also important to consider the thermal characteristics of the chip model, as well as the reliability of the components. Case studies have shown that the chip model is a reliable and efficient platform for embedded processing, image processing, and other digital signal processing applications.
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