EPF8282ATI100-3
EPF8282ATI100-3 ECAD Model
EPF8282ATI100-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 78 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 208 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 78 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 78 I/O | |
| Additional Feature | 208 LOGIC ELEMENTS | |
| Clock Frequency-Max | 385 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 235 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | PLASTIC, TQFP-100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 100 |
EPF8282ATI100-3 Datasheet Download
EPF8282ATI100-3 Overview
The chip model EPF8282ATI100-3 has been a popular choice for many applications due to its performance and reliability. It is a single-chip solution for a variety of communication systems, providing a low-cost, low-power, high-performance platform for applications ranging from basic networking to more advanced communication systems.
The EPF8282ATI100-3 supports a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It is also capable of supporting multiple operating systems, making it a versatile choice for many applications. In addition, the chip model is capable of supporting multiple digital signal processing functions, such as digital filtering, modulation, and demodulation. This makes it ideal for use in applications that require complex signal processing.
The EPF8282ATI100-3 is designed to be easily upgradable, allowing users to upgrade to the latest technologies without having to replace the entire system. This makes it a great choice for applications that require frequent upgrades. In addition, the chip model is designed to be compatible with a variety of different networks, making it a great choice for applications that require multiple networks to be connected.
The EPF8282ATI100-3 is also capable of being used in the era of fully intelligent systems. It is capable of supporting a variety of different intelligent scenarios, such as artificial intelligence, machine learning, and natural language processing. This makes it an ideal choice for applications that require advanced communication systems.
In conclusion, the EPF8282ATI100-3 is a versatile and reliable chip model that is capable of supporting a variety of different communication protocols, operating systems, and digital signal processing functions. It is also capable of being easily upgradable and compatible with multiple networks, making it a great choice for applications that require frequent upgrades or multiple networks. Furthermore, it is capable of supporting a variety of intelligent scenarios, making it an ideal choice for applications that require advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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