EPM5130LC-1
EPM5130LC-1 ECAD Model
EPM5130LC-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 40 ns | |
| Number of Dedicated Inputs | 19 | |
| Number of Macro Cells | 128 | |
| Number of I/O Lines | 48 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 19 DEDICATED INPUTS, 48 I/O | |
| Additional Feature | LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK... more | |
| Clock Frequency-Max | 50 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPM5130LC-1 Datasheet Download
EPM5130LC-1 Overview
The chip model EPM5130LC-1 is an innovative integrated circuit (IC) that offers a wide range of features and benefits to the user. It is designed to meet the needs of a variety of applications, from low-power embedded systems to high-performance communication systems. It is also highly efficient and cost-effective, making it an attractive choice for many industries.
The EPM5130LC-1 chip model provides a wide range of features and advantages. It is designed to be highly efficient, with a low power consumption and low heat dissipation. It also features a wide operating temperature range, making it suitable for use in a variety of applications and environments. Additionally, it is highly reliable, with a long service life and low failure rate.
The EPM5130LC-1 chip model is also designed to be highly scalable, with the ability to upgrade to higher performance levels as needed. This makes it ideal for use in advanced communication systems, as it can be easily adapted to changing requirements. Additionally, it is designed to be highly compatible with other ICs, allowing for easy integration into existing systems.
In terms of product design, the EPM5130LC-1 chip model is designed to meet the requirements of a variety of applications. It is designed to provide a wide range of features and benefits, including high-speed data transfer, low power consumption, and high reliability. Additionally, it is designed to be highly compatible with other ICs, allowing for easy integration into existing systems.
The EPM5130LC-1 chip model has been used in a variety of applications and industries, including automotive, industrial, and medical. In each of these industries, the chip model has been used to provide reliable, efficient, and cost-effective solutions. Additionally, it has been used to provide high-speed data transfer, low power consumption, and high reliability.
In terms of future demand trends, the EPM5130LC-1 chip model is expected to remain popular in a variety of industries. As technology advances and more applications require higher performance levels, the chip model will be well positioned to meet those needs. Additionally, its scalability and compatibility make it an attractive option for many industries.
In summary, the EPM5130LC-1 chip model is an innovative integrated circuit that offers a wide range of features and benefits. It is designed to be highly efficient, with a low power consumption and low heat dissipation. Additionally, it is designed to be highly scalable, with the ability to upgrade to higher performance levels as needed. It has been used in a variety of applications and industries, and is expected to remain popular in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||