5SGXEABK2H40I2G
5SGXEABK2H40I2G
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Intel

5SGXEABK2H40I2G


5SGXEABK2H40I2G
F18-5SGXEABK2H40I2G
Active
IC FPGA 696 I/O 1517HBGA
1517-HBGA (45x45)

5SGXEABK2H40I2G ECAD Model


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5SGXEABK2H40I2G Attributes


Type Description Select
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Ihs Manufacturer INTEL CORP
Package Description ,
Reach Compliance Code compliant
HTS Code 8542.39.00.01

5SGXEABK2H40I2G Datasheet Download


5SGXEABK2H40I2G Overview



The chip model 5SGXEABK2H40I2G is an important component of the semiconductor industry, and it has been widely used in many related industries. It is designed to provide high-performance, low-power solutions for a wide range of applications, including consumer electronics, automotive, and communication systems. The chip model 5SGXEABK2H40I2G is a highly integrated system-on-chip (SoC) that offers a wide range of features and capabilities, including a high-performance processor core, a large memory capacity, and a high-speed communication interface.


The chip model 5SGXEABK2H40I2G is designed to provide a cost-effective solution for a wide range of applications. It is designed to be highly scalable and can be customized to meet the specific needs of the customer. The chip model 5SGXEABK2H40I2G is designed to be power-efficient and provide a low-cost solution for a wide range of applications.


The chip model 5SGXEABK2H40I2G is designed to be highly reliable and is designed to provide a long-term solution for the customer. The chip model 5SGXEABK2H40I2G is designed to be able to support the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0. The chip model 5SGXEABK2H40I2G is designed to be able to support a wide range of advanced communication systems, such as the Internet of Things (IoT), machine-to-machine (M2M) communication, and advanced vehicle-to-vehicle (V2V) communication.


The chip model 5SGXEABK2H40I2G is designed to provide a cost-effective solution for a wide range of applications. It is expected that the demand for the chip model 5SGXEABK2H40I2G will continue to increase in the future, as more and more applications require the support of advanced technologies. The chip model 5SGXEABK2H40I2G is designed to be highly scalable and can be customized to meet the specific needs of the customer. The chip model 5SGXEABK2H40I2G is designed to be highly reliable and is designed to provide a long-term solution for the customer.


The chip model 5SGXEABK2H40I2G is designed to be highly upgradable and is designed to be able to support the latest technologies. The chip model 5SGXEABK2H40I2G is designed to be able to support a wide range of advanced communication systems, such as the Internet of Things (IoT), machine-to-machine (M2M) communication, and advanced vehicle-to-vehicle (V2V) communication. The chip model 5SGXEABK2H40I2G is designed to be highly reliable and is designed to provide a long-term solution for the customer.


Overall, the chip model 5SGXEABK2H40I2G is an important component of the semiconductor industry, and it has been widely used in many related industries. It is designed to provide a cost-effective solution for a wide range of applications, and it is expected that the demand for the chip model 5SGXEABK2H40I2G will continue to increase in the future. The chip model 5SGXEABK2H40I2G is designed to be highly upgradable and is designed to be able to support the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0. The chip model 5SGXEABK2H40I2G is designed to be able to support a wide range of advanced communication systems, such as the Internet of Things (IoT), machine-to-machine (M2M) communication, and advanced vehicle-to-vehicle (V2V) communication. It is designed to be highly reliable and is designed to provide a long-term solution for the customer.



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