EP20K30EFI144-2XN
EP20K30EFI144-2XN
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rohs
Intel

EP20K30EFI144-2XN


EP20K30EFI144-2XN
F18-EP20K30EFI144-2XN
Active
IC FPGA 93 I/O 144FBGA
144-FBGA (13x13)

EP20K30EFI144-2XN ECAD Model


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EP20K30EFI144-2XN Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.8 V
Propagation Delay 2.69 ns
Number of Inputs 85
Number of Outputs 85
Number of Logic Cells 1200
Number of Dedicated Inputs 4
Number of I/O Lines 93
Programmable Logic Type LOADABLE PLD
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 93 I/O
Output Function MACROCELL
Power Supplies 1.8,1.8/3.3 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 144
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm
Length 13 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description FINE LINE, BGA-144
Pin Count 144
Reach Compliance Code unknown
HTS Code 8542.39.00.01

EP20K30EFI144-2XN Datasheet Download


EP20K30EFI144-2XN Overview



The chip model EP20K30EFI144-2XN is a highly advanced integrated circuit that has been designed to meet the needs of the modern networked world. It has been designed to be a highly efficient, reliable and cost-effective solution for a wide range of applications. It is a highly integrated system-on-chip (SoC) that combines a variety of functions including high-speed data processing, memory management, communication and control.


The EP20K30EFI144-2XN chip model has a number of advantages that make it an attractive choice for a wide range of industries. It is capable of providing high-speed data processing, memory management, communication and control. This makes it an ideal choice for a variety of applications such as high-speed wireless networks, data centers, and embedded systems. Additionally, the chip model has a small form factor which makes it easy to integrate into existing systems.


The EP20K30EFI144-2XN chip model is also capable of providing a wide range of features that make it suitable for a variety of applications. It is capable of providing high-speed data transmission, low-latency communication, and a wide range of control functions. Additionally, the chip model is designed to be highly efficient, reliable and cost-effective. This makes it an ideal choice for a variety of industries such as industrial automation, medical devices, automotive, and consumer electronics.


The EP20K30EFI144-2XN chip model is also designed to be highly upgradable. This means that it can be easily upgraded to meet the needs of the latest technologies and applications. Additionally, it is capable of being used in advanced communication systems such as 5G networks, high-speed wireless networks, and satellite networks. This makes it a great choice for a variety of applications such as advanced communication systems, Internet of Things (IoT) applications, and mobile applications.


The EP20K30EFI144-2XN chip model is also capable of being used in a variety of intelligent scenarios. This includes applications such as artificial intelligence (AI), natural language processing (NLP), and machine learning (ML). Additionally, the chip model is capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes. This makes it a great choice for a variety of applications that require intelligent systems.


The EP20K30EFI144-2XN chip model is an ideal choice for a variety of industries that require high-speed data processing, memory management, communication and control. It is highly efficient, reliable and cost-effective, and it is capable of being upgraded to meet the needs of the latest technologies and applications. Additionally, it is capable of being used in a variety of intelligent scenarios and in the era of fully intelligent systems. As such, it is expected to be in high demand in the future.



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