EP3C25F324C6N
EP3C25F324C6N
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rohs
Intel

EP3C25F324C6N


EP3C25F324C6N
F18-EP3C25F324C6N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324
19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324

EP3C25F324C6N ECAD Model


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EP3C25F324C6N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 215
Number of Outputs 215
Number of Logic Cells 24624
Number of CLBs 24624
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape RECTANGULAR
Technology CMOS
Organization 24624 CLBS
Clock Frequency-Max 472.5 MHz
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code R-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,18X18,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2.2 mm
Ihs Manufacturer INTEL CORP
Package Description 19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3C25F324C6N Datasheet Download


EP3C25F324C6N Overview



The chip model EP3C25F324C6N is a high-performance, low-power, and cost-effective field-programmable gate array (FPGA) designed to meet the needs of a wide range of applications. It is suitable for applications such as high-performance digital signal processing, embedded processing, image processing, and other advanced communication systems.


The original design intention of the EP3C25F324C6N was to provide a low-cost solution for applications that require high-performance, low-power, and cost-effective FPGA solutions. It is designed with a relatively small footprint and low power consumption, making it ideal for applications that require a small form factor. The EP3C25F324C6N also has the potential to be upgraded with future technology advancements, allowing for increased performance and functionality.


The EP3C25F324C6N is designed for use with the HDL language. This allows for the implementation of complex logic functions and the ability to create custom designs quickly and efficiently. The chip model also provides a wide range of features, including high-speed transceivers, high-performance DSP blocks, and embedded memory blocks, making it suitable for a variety of applications.


When designing with the EP3C25F324C6N, it is important to consider the specific design requirements of the application. This includes the size of the design, the number of components, the speed of operation, and the power requirements. Additionally, it is important to consider the overall system architecture, as well as the potential for future upgrades.


To ensure successful implementation of the EP3C25F324C6N, it is important to review actual case studies and consider the potential pitfalls associated with the chip model. Additionally, it is important to consider the potential for future upgrades, as well as the potential for compatibility with existing systems.


Overall, the EP3C25F324C6N is a high-performance, low-power, and cost-effective FPGA solution that is suitable for a wide range of applications. It is designed with a small form factor and low power consumption, and it is designed for use with the HDL language. When designing with the EP3C25F324C6N, it is important to consider the specific design requirements of the application, as well as the potential for future upgrades and compatibility with existing systems.



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Unit Price: $92.37
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Pricing (USD)

QTY Unit Price Ext Price
1+ $92.3700 $92.3700
10+ $90.5226 $905.2260
100+ $88.6752 $8,867.5200
500+ $87.7515 $43,875.7500
1000+ $85.9041 $85,904.1000
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