EP3SL50F780C4L
EP3SL50F780C4L
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rohs
Intel

EP3SL50F780C4L


EP3SL50F780C4L
F18-EP3SL50F780C4L
Active
IC FPGA 488 I/O 780FBGA
780-FBGA (29x29)

EP3SL50F780C4L ECAD Model


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EP3SL50F780C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 47500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 780

EP3SL50F780C4L Datasheet Download


EP3SL50F780C4L Overview



The chip model EP3SL50F780C4L is an advanced technology designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool that requires the use of HDL language to program and configure the device. This chip model is a great choice for those looking to build or upgrade their current system.


The future of the chip model EP3SL50F780C4L and related industries depend on what specific technologies are needed. As technology advances, so does the need for new technologies and applications. The chip model EP3SL50F780C4L can be used to develop and popularize future intelligent robots, but it requires the right technical talents to use the model effectively.


The chip model EP3SL50F780C4L is an ideal choice for those looking for a powerful and efficient system for digital signal processing, embedded processing, and image processing. The chip model is capable of running complex algorithms and can be programmed and configured using HDL language. This makes the chip model an excellent choice for those who are looking to build or upgrade their current system.


In terms of future development, the chip model EP3SL50F780C4L can be used to develop and popularize future intelligent robots. However, it requires the right technical talents to use the model effectively. Technical experts who are knowledgeable in HDL language and have experience in programming and configuring the chip model are essential for the successful development and deployment of these robots.


In conclusion, the chip model EP3SL50F780C4L is an ideal choice for those looking for a powerful and efficient system for digital signal processing, embedded processing, and image processing. The chip model is capable of running complex algorithms and can be programmed and configured using HDL language. Furthermore, the chip model can be used to develop and popularize future intelligent robots, but it requires the right technical talents to use the model effectively.



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