EPF10K50SFC484-3
EPF10K50SFC484-3
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Intel

EPF10K50SFC484-3


EPF10K50SFC484-3
F18-EPF10K50SFC484-3
Active
IC FPGA 220 I/O 484FBGA
484-FBGA (23x23)

EPF10K50SFC484-3 ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

EPF10K50SFC484-3 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 500 ps
Number of Inputs 254
Number of Outputs 254
Number of Logic Cells 2880
Number of I/O Lines 254
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 254 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Pin Count 484
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF10K50SFC484-3 Datasheet Download


EPF10K50SFC484-3 Overview



The chip model EPF10K50SFC484-3 is a versatile and powerful integrated circuit that has been designed to meet the needs of many industries. It is a high-performance field-programmable gate array (FPGA) device that features an array of logic cells with a wide variety of configurable options. It is capable of providing fast and reliable signal processing, data storage, and communication services.


The EPF10K50SFC484-3 chip model offers a number of advantages over traditional integrated circuit designs. It provides higher integration density, which allows it to fit into smaller packages and save on board space. The device also has a higher speed, which enables it to support faster communication and data processing. Furthermore, the chip model is designed to be highly reliable and can withstand extreme temperatures and other harsh conditions.


In terms of expected demand trends for the EPF10K50SFC484-3 chip model, there is likely to be an increase in its use in the coming years. This is due to the fact that many industries are now embracing the use of FPGAs for their signal processing, data storage, and communication needs. This is especially true in the automotive and aerospace industries, where FPGA technology is being used to create more efficient and reliable systems.


The original design intention of the EPF10K50SFC484-3 chip model was to provide a highly configurable and powerful integrated circuit that could meet the needs of many industries. It has been designed to be easily upgradable, allowing it to be used in the latest communication systems. This means that the chip model can easily be adapted to the changing needs of the industry, making it a great choice for those looking for an affordable and reliable solution.


In terms of product description and specific design requirements, the EPF10K50SFC484-3 chip model is a high-performance FPGA device that features an array of logic cells with a wide variety of configurable options. It is specifically designed to support fast and reliable signal processing, data storage, and communication services. It is also designed to be highly reliable and can withstand extreme temperatures and other harsh conditions.


When considering the use of the EPF10K50SFC484-3 chip model, it is important to consider actual case studies and precautions. For instance, the device should be used in accordance with the manufacturer's instructions and should not be used in any way that could cause damage to the device or to other components. It is also important to consider the environmental conditions in which the device will be used, as it may not be suitable for certain extreme temperatures or other harsh conditions.


Overall, the EPF10K50SFC484-3 chip model is a versatile and powerful integrated circuit that has been designed to meet the needs of many industries. It provides a number of advantages over traditional integrated circuit designs, and its use is likely to increase in the coming years due to the increasing demand for FPGA technology. It is important to consider the product description and specific design requirements, as well as actual case studies and precautions, when considering the use of the EPF10K50SFC484-3 chip model.



3,403 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote