EPF8282ATI100-3N
EPF8282ATI100-3N ECAD Model
EPF8282ATI100-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 78 | |
| Number of Outputs | 78 | |
| Number of Logic Cells | 208 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 78 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 78 I/O | |
| Additional Feature | 208 LOGIC ELEMENTS | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3,3.3/5,5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, TQFP100,.63SQ | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF8282ATI100-3N Datasheet Download
EPF8282ATI100-3N Overview
The chip model EPF8282ATI100-3N is a modern integrated circuit that is used in a variety of industries, ranging from consumer electronics to telecommunications. It is designed to support advanced communication systems and can be used in a variety of applications, such as network routers, switches, and cellular base stations.
The EPF8282ATI100-3N chip model has been designed to meet the current industry trends and to be able to be upgraded in the future. It is equipped with a variety of features, such as high-speed data transfer, advanced security protocols, and a wide range of communication protocols. It also supports a variety of operating systems and is compatible with a wide range of devices.
The EPF8282ATI100-3N chip model is capable of being used in a variety of intelligent scenarios. It is capable of being used in networks, such as in wireless and wired networks. It is also capable of being used in the era of fully intelligent systems, such as in the Internet of Things (IoT). It can be used to create intelligent systems that can control a variety of devices and can be used to create intelligent applications that can be used to control various devices.
The EPF8282ATI100-3N chip model is also capable of being used in a variety of applications, such as in the automotive industry, in robotics, and in medical devices. It is capable of being used in a variety of industries, such as in telecommunications, in the energy sector, and in the aerospace industry.
The EPF8282ATI100-3N chip model is designed to meet the current industry trends and to be able to be upgraded in the future. It is equipped with a variety of features, such as high-speed data transfer, advanced security protocols, and a wide range of communication protocols. It also supports a variety of operating systems and is compatible with a wide range of devices.
The EPF8282ATI100-3N chip model is capable of being used in a variety of intelligent scenarios. It is capable of being used in networks, such as in wireless and wired networks. It is also capable of being used in the era of fully intelligent systems, such as in the Internet of Things (IoT). It can be used to create intelligent systems that can control a variety of devices and can be used to create intelligent applications that can be used to control various devices.
The EPF8282ATI100-3N chip model is designed to meet the current industry trends and to be able to be upgraded in the future. It is equipped with a variety of features, such as high-speed data transfer, advanced security protocols, and a wide range of communication protocols. It also supports a variety of operating systems and is compatible with a wide range of devices. It is also capable of being used in a variety of applications, such as in the automotive industry, in robotics, and in medical devices.
The EPF8282ATI100-3N chip model is designed to meet the current industry trends and to be able to be upgraded in the future. It is capable of providing support for new technologies if the application environment requires them. It is also capable of being used in a variety of intelligent scenarios and is capable of being used in the era of fully intelligent systems.
In conclusion, the EPF8282ATI100-3N chip model is a modern integrated circuit that is designed to meet the current industry trends and to be able to be upgraded in the future. It is equipped with a variety of features, such as high-speed data transfer, advanced security protocols, and a wide range of communication protocols. It also supports a variety of operating systems and is compatible with a wide range of devices. It is capable of providing support for new technologies if the application environment requires them. It is also capable of being used in a variety of intelligent scenarios and is capable of being used in the era of fully intelligent systems.
You May Also Be Interested In
2,493 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||