EPF8452ATC100-2
EPF8452ATC100-2
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rohs
Intel

EPF8452ATC100-2


EPF8452ATC100-2
F18-EPF8452ATC100-2
Active
LOADABLE PLD, CMOS, LFQFP, TQFP100,.63SQ
LFQFP, TQFP100,.63SQ

EPF8452ATC100-2 ECAD Model


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EPF8452ATC100-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 68
Number of Outputs 64
Number of Logic Cells 336
Number of Dedicated Inputs 4
Number of I/O Lines 78
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 78 I/O
Additional Feature 336 LOGIC ELEMENTS
Clock Frequency-Max 417 MHz
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code TQFP100,.63SQ
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.27 mm
Ihs Manufacturer INTEL CORP
Package Description LFQFP, TQFP100,.63SQ
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF8452ATC100-2 Datasheet Download


EPF8452ATC100-2 Overview



The chip model EPF8452ATC100-2 is a high-performance and versatile chip model that is suitable for various applications, such as high-performance digital signal processing, embedded processing, image processing, and more. This chip model is capable of performing complex tasks with its powerful and efficient architecture, and it requires the use of HDL language.


The EPF8452ATC100-2 has several advantages that make it a desirable choice for many applications. It is a highly integrated chip model that offers high performance, low power consumption, and cost-effectiveness. It also has a wide range of operating frequencies, making it suitable for a variety of applications. Additionally, it has a wide range of memory options, allowing for greater flexibility and scalability.


The demand for the EPF8452ATC100-2 is expected to grow in the future, as more and more applications require its features. With the increasing demand for faster and more efficient processing, the chip model is likely to become even more popular. Additionally, with the development of new technologies, such as artificial intelligence and the Internet of Things, the demand for high-performance chips such as the EPF8452ATC100-2 is likely to increase.


The EPF8452ATC100-2 is likely to be used in many network applications in the future. It is well-suited for applications such as wireless networking, data centers, and storage systems. Additionally, it can be used in intelligent scenarios, such as autonomous vehicles, robotics, and medical imaging. As technology advances, the chip model may also be used in fully intelligent systems, such as smart homes and smart cities.


In conclusion, the EPF8452ATC100-2 is a powerful and versatile chip model that is suitable for a wide range of applications. It offers high performance, low power consumption, and cost-effectiveness. Additionally, its demand is expected to increase in the future as more and more applications require its features. Finally, it is likely to be used in many network applications, as well as intelligent scenarios, and it may even be used in the era of fully intelligent systems.



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