EPF8452ATC100-3N
EPF8452ATC100-3N
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rohs
Intel

EPF8452ATC100-3N


EPF8452ATC100-3N
F18-EPF8452ATC100-3N
Active
IC FPGA 78 I/O 100TQFP
100-TQFP (14x14)

EPF8452ATC100-3N ECAD Model


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EPF8452ATC100-3N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 68
Number of Outputs 68
Number of Logic Cells 336
Number of Dedicated Inputs 4
Number of I/O Lines 78
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 78 I/O
Additional Feature 336 LOGIC ELEMENTS
Clock Frequency-Max 385 MHz
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code TQFP100,.63SQ
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.27 mm
Ihs Manufacturer INTEL CORP
Package Description LFQFP, TQFP100,.63SQ
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF8452ATC100-3N Datasheet Download


EPF8452ATC100-3N Overview



The chip model EPF8452ATC100-3N is a powerful and versatile solution for high-performance digital signal processing, embedded processing and image processing. It is designed to enable developers to create complex applications using the HDL language.


The industry trends in chip model EPF8452ATC100-3N have been driven by the need for increased performance, more efficient power consumption and smaller form factors. This has led to the development of new technologies such as advanced lithography, advanced packaging, and advanced system-on-chip (SoC) design.


The original design intention of the chip model EPF8452ATC100-3N was to provide a highly efficient and powerful solution for digital signal processing, embedded processing and image processing applications. It has the potential for future upgrades, such as the integration of new technologies and the addition of features like advanced communication systems.


The application environment of the chip model EPF8452ATC100-3N requires the support of new technologies in order to achieve the desired performance. These technologies include advanced lithography, advanced packaging, and advanced system-on-chip (SoC) design.


The chip model EPF8452ATC100-3N is an excellent solution for high-performance digital signal processing, embedded processing and image processing applications. It has the potential for future upgrades, and its application environment requires the support of new technologies in order to achieve the desired performance. As the industry trends in chip model EPF8452ATC100-3N continue to evolve, it is likely that future upgrades and new technologies will be needed in order to keep up with the ever-changing demands of the industry.



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