ER3110DI
ER3110DI
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Intel

ER3110DI


ER3110DI
F18-ER3110DI
Active
IC REG BUCK ADJUSTABLE 1A 12DFN
12-DFN (4x3)

ER3110DI ECAD Model


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ER3110DI Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Input Voltage-Nom 6 V
Input Voltage-Max 36 V
Input Voltage-Min 3 V
Output Current-Max 1.7 A
Surface Mount YES
Switcher Configuration BUCK
Switching Frequency-Max 2 MHz
Additional Feature ALSO OPERATES IN PFM CONTROL TECHNIQUE
Analog IC - Other Type SWITCHING REGULATOR
Control Mode CURRENT-MODE
Control Technique PULSE WIDTH MODULATION
Number of Functions 1
Temperature Grade AUTOMOTIVE
JESD-30 Code R-PDSO-N12
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 12
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Surface Mount YES
Terminal Form NO LEAD
Terminal Pitch 500 µm
Terminal Position DUAL
Width 3 mm
Length 4 mm
Seated Height-Max 1 mm
Ihs Manufacturer INTEL CORP
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

ER3110DI Datasheet Download


ER3110DI Overview



The chip model ER3110DI is a highly advanced semiconductor product designed to meet the needs of modern communication systems. This chip model is designed to be compatible with both wired and wireless communication systems and is capable of providing high-speed data transmission and reliable communication. It is also designed to be compatible with various communication protocols, allowing for easy integration into existing networks.


The original design intention of the chip model ER3110DI is to provide a reliable and efficient solution for communication systems. It is designed to be compatible with existing protocols, allowing for easy integration into existing networks. This chip model is also designed to be able to handle high-speed data transmission and reliable communication. Additionally, it is designed to be compatible with various communication protocols, allowing for easy integration into existing networks.


The ER3110DI chip model is also capable of being upgraded in the future. This chip model is designed to be able to be upgraded with new features and protocols, allowing for more advanced communication systems. This chip model is also capable of being adapted to different communication protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication.


The ER3110DI chip model is also capable of being applied to advanced communication systems. This chip model is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.


The ER3110DI chip model is also capable of being applied to intelligent scenarios. This chip model is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.


The product description of the ER3110DI chip model states that it is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.


The specific design requirements of the ER3110DI chip model include a power supply of 3.3V, a maximum clock frequency of 100MHz, and a maximum data rate of 1Gbps. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks.


Case studies have been conducted to evaluate the performance of the ER3110DI chip model. These case studies have shown that the chip model is capable of providing reliable communication and high-speed data transmission. Additionally, the case studies have shown that this chip model is capable of being adapted to different communication protocols, allowing for easy integration into existing networks.


When using the ER3110DI chip model, it is important to keep in mind that it is designed to be compatible with existing protocols, allowing for easy integration into existing networks. Additionally, this chip model is designed to be able to handle high-speed data transmission and reliable communication. Additionally, this chip model is designed to be able to be adapted to different communication protocols, allowing for easy integration into existing networks. It is also important to ensure that the chip model is properly configured and that all necessary precautions are taken when using it.



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Unit Price: $3.2129
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3.2129 $3.2129
10+ $3.1486 $31.4864
100+ $3.0844 $308.4384
500+ $3.0523 $1,526.1275
1000+ $2.9880 $2,987.9970
The price is for reference only, please refer to the actual quotation!

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