ISPLSI 2064E-200LT100

The ISPLSI 2064E-200LT100 is a high performance, low-power Field Programmable Gate Array (FPGA) chip model manufactured by Lattice Semiconductor. It is a member of the LatticeXP family of FPGAs and features a wide range of features and capabilities.

The chip is a high-density device that offers up to 200K logic elements, up to 4Mbit of embedded RAM, up to 4Kbit of distributed RAM, up to 2Kbit of distributed ROM, up to 8Kbit of distributed registers, up to 128Kbit of distributed logic, and up to 8Kbit of distributed I/O. It is also capable of supporting up to 8 clock sources, up to 32 I/O channels, and up to 4 dedicated I/O banks.

The ISPLSI 2064E-200LT100 is designed for a wide range of applications, including communications, embedded systems, consumer electronics, and industrial applications. It is ideal for designs that require high performance and low power consumption, such as those found in networking and telecommunications systems.

The ISPLSI 2064E-200LT100 is available in a variety of packages, including a 100-pin TQFP package, a 100-pin BGA package, and a 144-pin BGA package. It is also RoHS compliant, making it a suitable choice for projects that adhere to environmental regulations.

In conclusion, the ISPLSI 2064E-200LT100 is a high performance, low-power FPGA chip model that is suitable for a wide range of applications. It is a highly configurable device that offers up to 200K logic elements, up to 4Mbit of embedded RAM, up to 4Kbit of distributed RAM, up to 2Kbit of distributed ROM, up to 8Kbit of distributed registers, up to 128Kbit of distributed logic, and up to 8Kbit of distributed I/O. It is available in a variety of packages, making it a suitable choice for projects that adhere to environmental regulations.