LC4512B-35T176C
LC4512B-35T176C
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LC4512B-35T176C


LC4512B-35T176C
F11-LC4512B-35T176C
Active
IC CPLD 512MC 3.5NS 176TQFP
176-TQFP (24x24)

LC4512B-35T176C ECAD Model


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LC4512B-35T176C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispMACH® 4000B
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 3.5 ns
Voltage Supply - Internal 2.3V ~ 2.7V
Number of Logic Elements/Blocks 32
Number of Macrocells 512
Number of I/O 128
Operating Temperature 0°C ~ 90°C (TJ)
Mounting Type Surface Mount
Package / Case 176-LQFP
Supplier Device Package 176-TQFP (24x24)
Base Product Number LC4512

LC4512B-35T176C Datasheet Download


LC4512B-35T176C Overview



The LC4512B-35T176C is a low-power, low-voltage, high-performance, field-programmable gate array (FPGA) chip. It is designed to provide a cost-effective solution for a wide range of applications. The chip has 176 I/O pins, a total of 35K logic elements, and a maximum power consumption of 1.5 watts. It is capable of operating at a maximum clock frequency of up to 250 MHz.


The chip is built using a 0.35-micron CMOS process, and features a wide array of features, such as two-level logic synthesis, embedded memory blocks, and embedded multipliers. It also includes a high-performance system bus, which is capable of supporting up to 32-bit wide data transfers.


The LC4512B-35T176C is suitable for a variety of applications, including embedded systems, digital signal processing, and image processing. It can also be used for communications and networking, automotive, and industrial control. The chip is also ideal for applications requiring high-density logic, high performance, and low power consumption.


In summary, the LC4512B-35T176C is a low-power, low-voltage, high-performance FPGA chip, designed to provide a cost-effective solution for a wide range of applications. It features 176 I/O pins, a total of 35K logic elements, and a maximum power consumption of 1.5 watts. It is suitable for a variety of applications, including embedded systems, digital signal processing, image processing, communications and networking, automotive, and industrial control.



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