LCMXO2280E-5BN256C

The LCMXO2280E-5BN256C is a low-power, low-cost, field-programmable gate array (FPGA) chip from Lattice Semiconductor Corporation. This device is based on the company’s low-power, low-cost, non-volatile, low-density FPGA architecture, which features a low-power, low-cost, low-density, non-volatile FPGA fabric.

The LCMXO2280E-5BN256C is a 256-pin, 5V-tolerant, 0.5mm pitch, BGA package device with a total of 5,832 logic cells, 4,096 flip-flops, 288 Kbits of embedded RAM, and up to 8,192 bits of user I/O. It also features a wide range of I/O standards, including LVDS, LVCMOS, and differential I/O standards. It has a maximum clock frequency of 200 MHz, and a maximum operating temperature range of -40°C to +85°C.

The LCMXO2280E-5BN256C is suitable for a wide range of applications, including industrial automation, medical imaging, automotive, aerospace, and consumer electronics. It is also suitable for applications that require low power consumption, low cost, and high performance. This chip model is ideal for applications such as digital signal processing, embedded control, data acquisition, communications, and image processing.

In conclusion, the LCMXO2280E-5BN256C is a low-power, low-cost, field-programmable gate array (FPGA) chip from Lattice Semiconductor Corporation. It features a wide range of I/O standards, a maximum clock frequency of 200 MHz, and a maximum operating temperature range of -40°C to +85°C. It is suitable for a wide range of applications, including industrial automation, medical imaging, automotive, aerospace, and consumer electronics.