LFE2M100SE-6F900I
LFE2M100SE-6F900I
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Lattice

LFE2M100SE-6F900I


LFE2M100SE-6F900I
F11-LFE2M100SE-6F900I
Active
IC FPGA 416 I/O 900FBGA
900-FPBGA (31x31)

LFE2M100SE-6F900I ECAD Model


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LFE2M100SE-6F900I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2M
Package Tray
Number of LABs/CLBs 11875
Number of Logic Elements/Cells 95000
Total RAM Bits 5435392
Number of I/O 416
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFE2M100

LFE2M100SE-6F900I Datasheet Download


LFE2M100SE-6F900I Overview



The LFE2M100SE-6F900I is a low-power, low-cost, high-speed, low-voltage FPGA chip from Lattice Semiconductor. It is designed for a wide range of applications such as industrial automation, communications, consumer electronics, and automotive. The chip is a member of the LFE2M family, featuring a low-power, low-cost, and high-speed architecture. It is a 6-input, 900-gate FPGA which operates on 1.2V and is capable of speeds up to 400MHz. The chip is optimized for low-power designs and features a power-saving sleep mode. It also offers high-speed LVDS I/O and is compatible with the Lattice Diamond software.


The LFE2M100SE-6F900I has a total of 6,900 logic elements and is capable of handling up to 1,800 I/O pins. The chip also has a wide range of memory options including up to 1MB of RAM and 32KB of ROM. It also has a built-in clock multiplier, which is capable of providing up to four times the frequency of the input clock. The chip is also equipped with an array of configurable logic blocks, which can be used to create custom logic functions.


The LFE2M100SE-6F900I is ideal for applications that require low-power and high-speed performance. It is suitable for industrial automation, communications, consumer electronics, and automotive applications. It is also ideal for use in embedded systems and portable devices. The chip is also compatible with the Lattice Diamond software, making it easier to develop applications with the chip.



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