LFEC6E-3FN484I
LFEC6E-3FN484I
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Lattice

LFEC6E-3FN484I


LFEC6E-3FN484I
EC
F11-LFEC6E-3FN484I
Active
IC FPGA 224 I/O 484FBGA
484-FPBGA (23x23)

LFEC6E-3FN484I ECAD Model


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LFEC6E-3FN484I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 224
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number LFEC6

LFEC6E-3FN484I Datasheet Download


LFEC6E-3FN484I Overview



The LFEC6E-3FN484I is a low-power, low-cost, field-programmable gate array (FPGA) chip from Lattice Semiconductor. It is designed to provide a flexible, cost-efficient platform for a variety of embedded applications. The chip has a low power consumption of only 0.7W, making it ideal for battery-powered applications. It also provides a variety of features, such as a rich set of I/O options, high-performance logic, and a low-cost, small-footprint package.


The LFEC6E-3FN484I has a total of 484 logic cells, which are divided into two blocks of 242 cells each. The logic cells are organized into 16 columns, each containing 16 logic cells. The FPGA also features a wide range of I/O options, including LVDS, LVCMOS, and LVTTL, as well as an on-chip oscillator. Additionally, the chip also has a high-performance logic core, which is capable of operating at up to 200 MHz.


The LFEC6E-3FN484I is ideal for a variety of embedded applications, such as industrial automation, automotive, consumer electronics, and medical devices. It is also suitable for applications such as digital signal processing, image processing, and motor control. The chip is also capable of supporting a wide range of development platforms, such as the Lattice Diamond design software.


Overall, the LFEC6E-3FN484I is a low-cost, low-power FPGA chip that provides a flexible, cost-efficient platform for a range of embedded applications. It features a wide range of I/O options, high-performance logic, and a low-cost, small-footprint package. The chip is ideal for a variety of applications, such as industrial automation, automotive, consumer electronics, and medical devices.



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