LFEC6E-3TN144I
LFEC6E-3TN144I
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Lattice Semiconductor Corporation

LFEC6E-3TN144I


LFEC6E-3TN144I
EC
F11-LFEC6E-3TN144I
Active
IC FPGA 97 I/O 144TQFP
144-TQFP (20x20)

LFEC6E-3TN144I ECAD Model


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LFEC6E-3TN144I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 97
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Base Product Number LFEC6

LFEC6E-3TN144I Datasheet Download


LFEC6E-3TN144I Overview



The LFEC6E-3TN144I is an advanced Field Programmable Gate Array (FPGA) chip manufactured by Lattice Semiconductor. It is based on the company’s low-power, low-cost, low-density Enhanced CrossLink (ECL) architecture. The chip is designed to provide high-performance, low-power, and low-cost solutions for a wide range of applications.


The LFEC6E-3TN144I is an FPGA chip with a total of 144 logic cells, 3,000 logic elements and a maximum power consumption of 2.5 watts. The logic cells are divided into three types: logic, memory, and arithmetic. The logic cells are used for logic operations, the memory cells are used for data storage, and the arithmetic cells are used for calculations. The chip also features a high-speed, low-power, low-cost, low-density Enhanced CrossLink (ECL) architecture.


The LFEC6E-3TN144I is suitable for a wide range of applications, including embedded systems, industrial automation, medical devices, consumer electronics, automotive systems, and aerospace applications. It is also suitable for high-speed signal processing, high-speed communication, and other high-performance applications.


The LFEC6E-3TN144I is a reliable, low-cost, low-power solution for a wide range of applications. It is designed to provide high-performance, low-power, and low-cost solutions for a wide range of applications. It is suitable for a wide range of applications, including embedded systems, industrial automation, medical devices, consumer electronics, automotive systems, and aerospace applications.



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