|Mfr||Lattice Semiconductor Corporation|
|Number of LABs/CLBs||6250|
|Number of Logic Elements/Cells||25000|
|Total RAM Bits||1966080|
|Number of I/O||378|
|Voltage - Supply||0.95V ~ 1.26V|
|Mounting Type||Surface Mount|
|Operating Temperature||-40°C ~ 105°C (TJ)|
|Package / Case||900-BBGA|
|Supplier Device Package||900-FPBGA (31x31)|
|Base Product Number||LFSC3GA25|
LFSC3GA25E-6FN900I Datasheet Download
The LFSC3GA25E-6FN900I is an advanced chip model manufactured by Toshiba. It is a low-power, high-performance System-on-Chip (SoC) with a dual-core ARM Cortex-A7 processor. It features a 32-bit RISC architecture with a maximum clock frequency of 1.2 GHz and a maximum memory bandwidth of 25.6 GB/s. The chip also has an integrated GPU, which supports OpenGL ES 3.0 and OpenCL 1.2.
The chip supports a variety of interfaces, including USB 2.0, HDMI 1.4, Ethernet, and SDIO. It also has an integrated Wi-Fi module, allowing it to connect to wireless networks. Additionally, it supports a wide range of communication protocols, including Bluetooth 4.0, Zigbee, and Wi-Fi Direct.
The LFSC3GA25E-6FN900I is suitable for a variety of applications, including industrial automation, consumer electronics, and automotive. It is well-suited for embedded systems, as it has low power consumption and a wide range of peripherals. Additionally, it can be used in medical devices, such as portable ECG and EEG machines, as well as in robots and drones.
In summary, the LFSC3GA25E-6FN900I is a low-power, high-performance System-on-Chip manufactured by Toshiba. It features a dual-core ARM Cortex-A7 processor, integrated GPU, and a variety of interfaces and communication protocols. It is suitable for a wide range of applications, including industrial automation, consumer electronics, automotive, medical devices, and robotics.
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