LFSC3GA25E-6FN900I

The LFSC3GA25E-6FN900I is an advanced chip model manufactured by Toshiba. It is a low-power, high-performance System-on-Chip (SoC) with a dual-core ARM Cortex-A7 processor. It features a 32-bit RISC architecture with a maximum clock frequency of 1.2 GHz and a maximum memory bandwidth of 25.6 GB/s. The chip also has an integrated GPU, which supports OpenGL ES 3.0 and OpenCL 1.2.

The chip supports a variety of interfaces, including USB 2.0, HDMI 1.4, Ethernet, and SDIO. It also has an integrated Wi-Fi module, allowing it to connect to wireless networks. Additionally, it supports a wide range of communication protocols, including Bluetooth 4.0, Zigbee, and Wi-Fi Direct.

The LFSC3GA25E-6FN900I is suitable for a variety of applications, including industrial automation, consumer electronics, and automotive. It is well-suited for embedded systems, as it has low power consumption and a wide range of peripherals. Additionally, it can be used in medical devices, such as portable ECG and EEG machines, as well as in robots and drones.

In summary, the LFSC3GA25E-6FN900I is a low-power, high-performance System-on-Chip manufactured by Toshiba. It features a dual-core ARM Cortex-A7 processor, integrated GPU, and a variety of interfaces and communication protocols. It is suitable for a wide range of applications, including industrial automation, consumer electronics, automotive, medical devices, and robotics.