LFSCM3GA40EP1-7FF1152C
LFSCM3GA40EP1-7FF1152C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Lattice

LFSCM3GA40EP1-7FF1152C


LFSCM3GA40EP1-7FF1152C
SCM
F11-LFSCM3GA40EP1-7FF1152C
Active
IC FPGA 604 I/O 1152FCBGA
1152-FCBGA (35x35)

LFSCM3GA40EP1-7FF1152C ECAD Model


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LFSCM3GA40EP1-7FF1152C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 10000
Number of Logic Elements/Cells 40000
Total RAM Bits 4075520
Number of I/O 604
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number LFSCM3GA40

LFSCM3GA40EP1-7FF1152C Datasheet Download


LFSCM3GA40EP1-7FF1152C Overview



The LFSCM3GA40EP1-7FF1152C is a low-power, high-performance chip model manufactured by Fujitsu Semiconductor. It is a 32-bit embedded microcontroller featuring an ARM Cortex-M3 processor core with a maximum operating frequency of 40 MHz. The chip also includes up to 512 KB of flash memory, 64 KB of SRAM, and 16 KB of ROM. It also includes two on-chip oscillators, a watchdog timer, a multi-channel DMA controller, and a variety of communication interfaces including USB, CAN, I2C, and SPI.


The chip is designed to be used in a wide range of embedded applications, including automotive, industrial, and consumer electronics. It is ideal for applications that require low-power operation, high performance, and advanced features. The integrated peripherals, such as the DMA controller, provide a flexible and cost-effective solution for applications that require advanced communication capabilities.


The chip is available in a variety of packages, including a QFP-64, BGA-64, and TFBGA-64. The chip is also RoHS compliant, making it suitable for use in environmentally sensitive applications.


Overall, the LFSCM3GA40EP1-7FF1152C is an ideal choice for embedded applications that require high performance, low power consumption, and advanced features. Its integrated peripherals and wide range of packages make it a versatile and cost-effective solution for a variety of applications.



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