LFX125EB-03FN256I
LFX125EB-03FN256I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Lattice

LFX125EB-03FN256I


LFX125EB-03FN256I
F11-LFX125EB-03FN256I
Active
IC FPGA 160 I/O 256FBGA
256-FPBGA (17x17)

LFX125EB-03FN256I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

LFX125EB-03FN256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispXPGA®
Package Tray
Number of Logic Elements/Cells 1936
Total RAM Bits 94208
Number of I/O 160
Number of Gates 139000
Voltage - Supply 2.3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFX125

LFX125EB-03FN256I Datasheet Download


LFX125EB-03FN256I Overview



The LFX125EB-03FN256I is a low-power, high-performance field-programmable gate array (FPGA) chip developed by Lattice Semiconductor. It is designed for use in high-density, low-power applications such as industrial, automotive, and consumer electronics products. The chip is housed in a 256-pin BGA package, which is compatible with all major FPGA packages, and has a maximum operating temperature of 105°C.


The LFX125EB-03FN256I features a low-power, low-cost, low-voltage 8K LUT architecture, which provides high-performance and low-power operation. It also features a wide range of configurable logic blocks, including two-input and four-input look-up tables, multiplexers, and adders. The chip also includes a wide range of I/Os, including LVDS, LVCMOS, and HSTL, as well as a variety of memory interfaces, including DDR2, DDR3, and QDR.


The LFX125EB-03FN256I is suitable for a variety of applications, including industrial control, automotive, and consumer electronics. It can be used to develop high-performance, low-power embedded systems, such as motor control, industrial automation, and video/audio systems. It is also suitable for a variety of communication and networking applications, such as Ethernet, Wi-Fi, and Bluetooth. The chip is also suitable for use in digital signal processing and image processing applications.


Overall, the LFX125EB-03FN256I is an ideal solution for high-density, low-power applications. It features a low-power, low-cost, low-voltage 8K LUT architecture and a wide range of configurable logic blocks, as well as a variety of I/Os and memory interfaces. It is suitable for a variety of applications, including industrial control, automotive, and consumer electronics.



3,199 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote