A3P250-1FGG256T
A3P250-1FGG256T ECAD Model
A3P250-1FGG256T Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 157 | |
| Number of Outputs | 157 | |
| Number of Logic Cells | 6144 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 6144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 250000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
A3P250-1FGG256T Datasheet Download
A3P250-1FGG256T Overview
The A3P250-1FGG256T is a Field Programmable Gate Array (FPGA) chip designed by Actel Corporation. It is a low-cost, low-power, high-performance device that can be used in a wide range of applications.
The A3P250-1FGG256T has a 0.18-micron process technology and is based on the A3P250 FPGA architecture. It has a total of 256 logic cells, with a total capacity of up to 256Kbits of RAM. It also has up to 16 dedicated I/O pins, with a total of up to 12 dedicated I/O banks. The chip also features a 32-bit RISC processor and a rich set of peripherals, such as SPI, UART, I2C, and PWM.
The A3P250-1FGG256T is ideal for applications requiring low power and high performance, such as embedded systems, industrial automation, automotive, and consumer electronics. It is also suitable for applications that require high levels of integration, such as image processing, video processing, and communications.
The A3P250-1FGG256T is easy to program and debug, and can be used with a variety of development tools. It is also RoHS compliant, making it suitable for use in green products. It is also backed by a strong warranty and is available in both commercial and industrial temperature ranges.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||