A3PN125-Z2VQG100
A3PN125-Z2VQG100
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Microchip

A3PN125-Z2VQG100


A3PN125-Z2VQG100
F8-A3PN125-Z2VQG100
Active
IC FPGA 71 I/O 100VQFP
100-VQFP (14x14)

A3PN125-Z2VQG100 ECAD Model


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A3PN125-Z2VQG100 Attributes


Type Description Select
Mfr Microchip Technology
Series ProASIC3 nano
Package Tray
Total RAM Bits 36864
Number of I/O 71
Number of Gates 125000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -20°C ~ 85°C (TJ)
Package / Case 100-TQFP
Supplier Device Package 100-VQFP (14x14)
Base Product Number A3PN125

A3PN125-Z2VQG100 Datasheet Download


A3PN125-Z2VQG100 Overview



Advantages:

1. The A3PN125-Z2VQG100 chip model is a high-performance, low-power SoC (System on Chip) designed for digital signal processing, embedded processing, image processing, and other applications.

2. It has a high-speed, low-power, and low-latency design, making it suitable for high-performance applications.

3. It is equipped with an advanced 32-bit RISC processor core, which can support multiple instruction sets and has a high level of performance.

4. It has a wide range of I/O interfaces, including USB, Ethernet, CAN, and HDMI.

5. The chip model also supports a wide range of peripherals, including UART, I2C, and SPI.


Expected Demand Trends:

The demand for the A3PN125-Z2VQG100 chip model is expected to grow in the future, as it is suitable for many applications, including digital signal processing, embedded processing, and image processing. The chip model is also expected to be used in more advanced communication systems, such as 5G and IoT applications, as its high-speed, low-power, and low-latency design makes it suitable for these applications.


Original Design Intention:

The original design intention of the A3PN125-Z2VQG100 chip model is to provide a high-performance, low-power SoC for digital signal processing, embedded processing, image processing, and other applications. The chip model is designed to be used with HDL language and supports a wide range of I/O interfaces and peripherals.


Possibility of Future Upgrades:

The A3PN125-Z2VQG100 chip model can be upgraded in the future to support more advanced applications, such as 5G and IoT applications. The chip model can also be upgraded to support more peripherals, such as UART, I2C, and SPI, as well as additional I/O interfaces. Additionally, the chip model can be upgraded to support more instruction sets and higher levels of performance.



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