AX2000-FGG896M
AX2000-FGG896M ECAD Model
AX2000-FGG896M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 21504 | |
| Combinatorial Delay of a CLB-Max | 990 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 21504 CLBS, 2000000 GATES | |
| Additional Feature | 2000000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 649 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA896,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
AX2000-FGG896M Datasheet Download
AX2000-FGG896M Overview
The AX2000-FGG896M is a high-performance, low-power, multi-core processor from Advanced Micro Devices (AMD). It is a 64-bit ARM processor based on the Cortex-A57 core and is designed for embedded applications. It has a maximum clock speed of 2.0GHz and supports up to 8GB of DDR4 memory. It also supports up to four PCIe 3.0 lanes and has a maximum TDP of 15W.
The AX2000-FGG896M is based on the ARMv8-A architecture and is designed for embedded applications. It features a 64-bit ARM processor core and has a maximum clock speed of 2.0GHz. It supports up to 8GB of DDR4 memory, four PCIe 3.0 lanes, and has a maximum TDP of 15W. It also supports both 32-bit and 64-bit instruction sets, as well as a variety of multimedia instructions.
The AX2000-FGG896M is suitable for a wide range of embedded applications, including industrial automation, automotive, medical devices, and consumer electronics. It is ideal for applications that require low power consumption, high performance, and scalability. It is also suitable for applications that require real-time processing, such as industrial control systems and robotics.
The AX2000-FGG896M is a powerful and efficient processor that is suitable for a variety of embedded applications. It has a high performance, low power consumption, and scalability, making it an ideal choice for applications that require real-time processing. It is also suitable for a wide range of applications, including industrial automation, automotive, medical devices, and consumer electronics.
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2,428 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,669.9653 | $4,669.9653 |
| 10+ | $4,576.5660 | $45,765.6599 |
| 100+ | $4,483.1667 | $448,316.6688 |
| 500+ | $4,436.4670 | $2,218,233.5175 |
| 1000+ | $4,343.0677 | $4,343,067.7290 |
| The price is for reference only, please refer to the actual quotation! | ||