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Microchip Technology Inc


BGA, BGA484,22X22,40

AX250-1FG484 ECAD Model

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AX250-1FG484 Attributes

Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 248
Number of Outputs 248
Number of Logic Cells 4224
Number of Equivalent Gates 250000
Number of CLBs 2816
Combinatorial Delay of a CLB-Max 840 ps
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 2816 CLBS, 250000 GATES
Additional Feature 250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 763 MHz
Power Supplies 1.5,1.5/3.3,2.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA, BGA484,22X22,40
Reach Compliance Code unknown
HTS Code 8542.39.00.01

AX250-1FG484 Datasheet Download

AX250-1FG484 Overview

The AX250-1FG484 is a low-power, high-performance Field Programmable Gate Array (FPGA) chip model from Xilinx. It is equipped with 250K logic elements and 1.2Mbits of block RAM, and is suitable for a wide range of applications, including embedded systems, industrial automation, digital signal processing (DSP) and communication systems.

The chip is based on a Virtex-4 architecture and has a maximum power dissipation of 4.8W. It is capable of running up to 200MHz and has a total of 486 user I/O pins. It also has a range of features such as digital clock management (DCM) and clock multiplier (CMT) for improved clock signal distribution, and a range of high-speed transceiver options.

The AX250-1FG484 is designed for use in harsh environments, with a range of features such as temperature-hardened I/O, internal temperature-sensor and thermal monitoring. It also has a range of security features, including secure boot, secure configuration and secure JTAG.

The chip is suitable for a wide range of applications, including embedded systems, industrial automation, digital signal processing (DSP) and communication systems. It is also suitable for applications that require low-power, high-performance and high-reliability, such as medical and aerospace applications.

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Unit Price: $247.164
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Pricing (USD)

QTY Unit Price Ext Price
1+ $229.8625 $229.8625
10+ $227.3909 $2,273.9088
100+ $215.0327 $21,503.2680
1000+ $202.6745 $101,337.2400
10000+ $185.3730 $185,373.0000
The price is for reference only, please refer to the actual quotation!

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