

MPF200T-FCG784I
MPF200T-FCG784I ECAD Model
MPF200T-FCG784I Attributes
Type | Description | Select |
---|---|---|
Mfr | Microchip Technology | |
Series | PolarFire™ | |
Package | Tray | |
Number of Logic Elements/Cells | 192000 | |
Total RAM Bits | 13619200 | |
Number of I/O | 364 | |
Voltage - Supply | 0.97V ~ 1.08V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 784-BBGA, FCBGA | |
Supplier Device Package | 784-FCBGA (29x29) | |
Base Product Number | MPF200 |
MPF200T-FCG784I Datasheet Download
MPF200T-FCG784I Overview
The chip model MPF200T-FCG784I is a cutting-edge technology in the semiconductor industry. It is a component of the semiconductor industry that is used to create integrated circuits (ICs). This particular chip model is designed to be highly efficient and cost-effective, making it a popular choice among many manufacturers. The MPF200T-FCG784I chip model is a high-performance, low-power solution that is designed to provide a wide range of features. It is capable of operating at up to 1.2GHz and supports a wide range of memory, storage, and communication protocols. This makes it ideal for a variety of applications, including consumer electronics, automotive, and industrial applications. The chip model is designed to be highly reliable and robust, making it suitable for long-term use in a variety of environments. It is also designed to be energy-efficient and has a low power consumption, making it an attractive choice for manufacturers who are looking to reduce their energy costs. The chip model is also designed to be highly flexible and customizable, allowing manufacturers to tailor the chip to their specific needs. This includes the ability to add new features, such as additional memory or communication protocols, as well as the ability to customize the design for specific applications. This makes the chip model an attractive choice for a wide range of applications. The chip model is also designed to be highly compatible with existing technologies, making it easy to integrate into existing systems. This makes it an ideal choice for manufacturers who are looking to upgrade their existing systems with the latest technologies. The chip model is also designed to be highly secure, making it an attractive choice for manufacturers who are looking to protect their data and systems. It is designed with advanced security features, such as encryption and authentication, making it an attractive choice for manufacturers who are looking to protect their data and systems. The chip model is also designed to be highly reliable and robust, making it suitable for long-term use in a variety of environments. The chip model is also designed to be energy-efficient and has a low power consumption, making it an attractive choice for manufacturers who are looking to reduce their energy costs. In terms of industry trends, the chip model MPF200T-FCG784I is expected to remain a popular choice for manufacturers in the future. As more manufacturers look for cost-effective, reliable, and secure solutions, the chip model is expected to remain a popular choice in the industry. However, the application environment may require the support of new technologies in order to take full advantage of the chip model. This could include new memory, storage, or communication protocols, or other technologies that are needed to make the chip model more compatible with existing systems. In conclusion, the chip model MPF200T-FCG784I is a cutting-edge technology in the semiconductor industry. It is designed to be highly efficient and cost-effective, making it a popular choice among many manufacturers. It is also designed to be highly reliable and robust, making it suitable for long-term use in a variety of environments. Furthermore, it is designed to be highly secure, making it an attractive choice for manufacturers who are looking to protect their data and systems. In terms of industry trends, the chip model is expected to remain a popular choice for manufacturers in the future. However, the application environment may require the support of new technologies in order to take full advantage of the chip model.