XC17S30XLVOG8I
XC17S30XLVOG8I
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Xilinx

XC17S30XLVOG8I


XC17S30XLVOG8I
F20-XC17S30XLVOG8I
Active
IC PROM SERIAL 3.3V 300K 8-SOIC
8-TSOP

XC17S30XLVOG8I ECAD Model


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XC17S30XLVOG8I Attributes


Type Description Select
Mfr AMD Xilinx
Package Tray
Programmable Type OTP
Memory Size 300kb
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-TSOP
Base Product Number XC17S30XL

XC17S30XLVOG8I Datasheet Download


XC17S30XLVOG8I Overview



The Xilinx model XC17S30XLVOG8I is a 3.3V, low-power, high-performance field-programmable gate array (FPGA) that belongs to the XC1700 family. It offers 2,000 usable gates, a maximum operating frequency of 150 MHz, and a total of 64 I/O pins. The device has an operating temperature range of -40°C to +85°C and is available in a 44-pin PLCC package.


The XC17S30XLVOG8I is designed to meet the needs of a wide range of applications, including networking, telecommunications, and industrial automation. It offers unparalleled flexibility and versatility, with a range of features that enable users to customize its functionality to meet their specific requirements. The FPGA's low-power consumption makes it an ideal choice for applications where power efficiency is critical. Additionally, the XC17S30XLVOG8I's high-performance capabilities enable it to handle complex processing tasks, making it an excellent choice for data-intensive applications.


In summary, the Xilinx model XC17S30XLVOG8I is a high-performance, low-power FPGA that is suitable for a range of applications. With its flexible architecture, powerful processing capabilities, and low power consumption, it offers an exceptional level of performance and functionality that makes it an ideal choice for a wide range of applications.



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