XC6SLX75T-N3FG676C
XC6SLX75T-N3FG676C ECAD Model
XC6SLX75T-N3FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Spartan®-6 LXT | |
| Package | Tray | |
| Number of LABs/CLBs | 5831 | |
| Number of Logic Elements/Cells | 74637 | |
| Total RAM Bits | 3170304 | |
| Number of I/O | 348 | |
| Voltage - Supply | 1.14V ~ 1.26V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Base Product Number | XC6SLX75 |
XC6SLX75T-N3FG676C Datasheet Download
XC6SLX75T-N3FG676C Overview
The XC6SLX75T-N3FG676C is a field-programmable gate array (FPGA) manufactured by Xilinx. It is a mid-range device, part of the Spartan-6 family, and is optimized for high performance and low power consumption. The XC6SLX75T-N3FG676C has a total of 75,000 logic cells and 576 Kbits of embedded memory. It is capable of running at speeds of up to 300MHz, and has a total power dissipation of 4.1W. It also comes with a range of I/O support, including LVDS, PCI Express, and USB. The XC6SLX75T-N3FG676C is designed for a variety of applications, including digital signal processing, embedded control, video and image processing, and high-speed networking. It can be used in a range of products, from medical devices to industrial automation systems. The XC6SLX75T-N3FG676C is available in a range of packages, including a 676-pin flip chip ball grid array (FCBGA). It is also compatible with a range of development boards, such as the Xilinx Spartan-6 LX75T Development Kit. Overall, the XC6SLX75T-N3FG676C is a powerful and efficient FPGA, designed for a range of applications. It is capable of running at high speeds, while consuming low power, making it an ideal choice for a variety of products.
