XCS30XL-3BG256C
XCS30XL-3BG256C
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rohs
Xilinx

XCS30XL-3BG256C


XCS30XL-3BG256C
F20-XCS30XL-3BG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-256
BGA

XCS30XL-3BG256C ECAD Model


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XCS30XL-3BG256C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 196
Number of Outputs 196
Number of Logic Cells 576
Number of Equivalent Gates 10000
Number of CLBs 576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCS30XL-3BG256C Datasheet Download


XCS30XL-3BG256C Overview



The XCS30XL-3BG256C chip model is the latest offering from the renowned semiconductor manufacturer Xilinx. This model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing applications. It has been designed to use the HDL (Hardware Description Language) to program the chip and make it suitable for a wide range of applications.


The XCS30XL-3BG256C chip model is a great choice for projects that require high performance and low power consumption. It has a low power consumption of only 4.5W, which makes it an ideal choice for applications that require long-term operation. It also has a high-speed clock frequency of up to 500MHz, which makes it suitable for high-performance digital signal processing. Additionally, it features up to 256KB of on-chip memory, which makes it an ideal choice for embedded processing and image processing.


The XCS30XL-3BG256C chip model is expected to be in high demand in the near future, as it is a great choice for applications that require high performance and low power consumption. It is also expected to be used in advanced communication systems, as its high-speed clock frequency and on-chip memory make it suitable for such applications.


The original design intention of the XCS30XL-3BG256C chip model was to provide a low-power solution for high-performance digital signal processing and embedded processing applications. Additionally, it was designed to be easily upgradable, so that it can be used for more advanced applications in the future. This makes it a great choice for projects that require a high level of performance and flexibility.


The XCS30XL-3BG256C chip model is a great choice for applications that require high performance and low power consumption. It is also expected to be in high demand in the near future, as it is suitable for advanced communication systems. Additionally, it was designed to be easily upgradable, so that it can be used for more advanced applications in the future. With its great performance, low power consumption, and upgradability, the XCS30XL-3BG256C chip model is sure to be a great choice for many projects in the near future.



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