XCS30XL-3BG256I
XCS30XL-3BG256I
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rohs
Xilinx

XCS30XL-3BG256I


XCS30XL-3BG256I
F20-XCS30XL-3BG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

XCS30XL-3BG256I ECAD Model


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XCS30XL-3BG256I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 10000
Number of CLBs 576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 576 CLBS, 10000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS30XL-3BG256I Datasheet Download


XCS30XL-3BG256I Overview



The chip model XCS30XL-3BG256I is a high-performance and versatile solution for digital signal processing, embedded processing, and image processing. It is designed with HDL language, which is a powerful and reliable language and is widely used in the semiconductor industry. The chip model XCS30XL-3BG256I is a cost-effective solution for these applications, providing users with excellent performance and reliability.


The chip model XCS30XL-3BG256I offers a wide range of features and capabilities that make it ideal for high-performance digital signal processing and embedded processing applications. It has a high-speed processor core, powerful memory, and advanced I/O interfaces. It also has a wide range of features that enable it to handle complex algorithms and data processing tasks. The chip model XCS30XL-3BG256I also has a low-power consumption design, making it suitable for battery-powered applications.


The chip model XCS30XL-3BG256I is expected to become increasingly popular in related industries in the future. Its performance, flexibility, and scalability make it an attractive solution for a variety of applications. It is also suitable for advanced communication systems, providing users with reliable and efficient communication solutions.


The original design intention of the chip model XCS30XL-3BG256I is to provide a cost-effective solution for high-performance digital signal processing, embedded processing, and image processing applications. It is designed with HDL language, which is a powerful and reliable language and is widely used in the semiconductor industry. The chip model XCS30XL-3BG256I is a cost-effective solution for these applications, providing users with excellent performance and reliability.


The chip model XCS30XL-3BG256I has the potential to be upgraded in the future. It is designed with an open architecture, allowing for flexibility and scalability. This allows users to customize the chip model XCS30XL-3BG256I to their specific needs and requirements. Additionally, the chip model XCS30XL-3BG256I can be applied to advanced communication systems, providing users with reliable and efficient communication solutions.


Overall, the chip model XCS30XL-3BG256I is a powerful and versatile solution for digital signal processing, embedded processing, and image processing applications. It is designed with HDL language, which is a powerful and reliable language and is widely used in the semiconductor industry. The chip model XCS30XL-3BG256I is expected to become increasingly popular in related industries in the future, and its potential for future upgrades and application to advanced communication systems make it an attractive solution for a variety of applications.



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