XCS30XL-3PQG208I
XCS30XL-3PQG208I ECAD Model
XCS30XL-3PQG208I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Organization | 576 CLBS, 10000 GATES | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 208 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS30XL-3PQG208I Datasheet Download
XCS30XL-3PQG208I Overview
Chip model XCS30XL-3PQG208I is a highly integrated and advanced chip model developed by Xilinx Inc. It is based on the Xilinx Virtex-4 family of Field Programmable Gate Arrays (FPGAs). This chip is designed to provide a wide range of features and functions for a variety of applications.
The XCS30XL-3PQG208I chip model has a wide range of features, including high-speed, low-power, and high-density logic integration. This chip model also supports a wide range of communication and data processing functions, such as Ethernet, PCI Express, and USB. It also supports advanced communication systems such as Wi-Fi and Bluetooth.
In terms of industry trends, the XCS30XL-3PQG208I chip model is designed to meet the needs of the emerging Internet of Things (IoT) and Industry 4.0 applications. As such, it is designed to be used in a variety of applications, such as automotive, industrial automation, and consumer electronics. It is also designed to support the latest technologies, such as 5G and artificial intelligence (AI).
In terms of its original design intention, the XCS30XL-3PQG208I chip model is designed to provide a wide range of features and functions for a variety of applications. It is designed to be used in a variety of applications, such as automotive, industrial automation, and consumer electronics. It is also designed to support the latest technologies, such as 5G and AI.
The product description of the XCS30XL-3PQG208I chip model includes a wide range of features and functions. It supports high-speed, low-power, and high-density logic integration. It also supports a wide range of communication and data processing functions, such as Ethernet, PCI Express, and USB. It also supports advanced communication systems such as Wi-Fi and Bluetooth.
In terms of actual case studies, the XCS30XL-3PQG208I chip model has been successfully used in a variety of applications, such as automotive, industrial automation, and consumer electronics. It has also been used to support the latest technologies, such as 5G and AI.
When using the XCS30XL-3PQG208I chip model, it is important to keep in mind that it is designed to meet the needs of the emerging IoT and Industry 4.0 applications. Therefore, it is important to ensure that the application environment is compatible with the chip model and that the necessary technologies are supported.
In conclusion, the XCS30XL-3PQG208I chip model is a highly integrated and advanced chip model developed by Xilinx Inc. It is designed to provide a wide range of features and functions for a variety of applications and to support the latest technologies, such as 5G and AI. It has been successfully used in a variety of applications and it is important to ensure that the application environment is compatible with the chip model and that the necessary technologies are supported.
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