XCS30XL-3PQG208I
XCS30XL-3PQG208I
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rohs
Xilinx

XCS30XL-3PQG208I


XCS30XL-3PQG208I
F20-XCS30XL-3PQG208I
Active
FIELD PROGRAMMABLE GATE ARRAY, FQFP
FQFP

XCS30XL-3PQG208I ECAD Model


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XCS30XL-3PQG208I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 10000
Number of CLBs 576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 576 CLBS, 10000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 208
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS30XL-3PQG208I Datasheet Download


XCS30XL-3PQG208I Overview



Chip model XCS30XL-3PQG208I is a highly integrated and advanced chip model developed by Xilinx Inc. It is based on the Xilinx Virtex-4 family of Field Programmable Gate Arrays (FPGAs). This chip is designed to provide a wide range of features and functions for a variety of applications.


The XCS30XL-3PQG208I chip model has a wide range of features, including high-speed, low-power, and high-density logic integration. This chip model also supports a wide range of communication and data processing functions, such as Ethernet, PCI Express, and USB. It also supports advanced communication systems such as Wi-Fi and Bluetooth.


In terms of industry trends, the XCS30XL-3PQG208I chip model is designed to meet the needs of the emerging Internet of Things (IoT) and Industry 4.0 applications. As such, it is designed to be used in a variety of applications, such as automotive, industrial automation, and consumer electronics. It is also designed to support the latest technologies, such as 5G and artificial intelligence (AI).


In terms of its original design intention, the XCS30XL-3PQG208I chip model is designed to provide a wide range of features and functions for a variety of applications. It is designed to be used in a variety of applications, such as automotive, industrial automation, and consumer electronics. It is also designed to support the latest technologies, such as 5G and AI.


The product description of the XCS30XL-3PQG208I chip model includes a wide range of features and functions. It supports high-speed, low-power, and high-density logic integration. It also supports a wide range of communication and data processing functions, such as Ethernet, PCI Express, and USB. It also supports advanced communication systems such as Wi-Fi and Bluetooth.


In terms of actual case studies, the XCS30XL-3PQG208I chip model has been successfully used in a variety of applications, such as automotive, industrial automation, and consumer electronics. It has also been used to support the latest technologies, such as 5G and AI.


When using the XCS30XL-3PQG208I chip model, it is important to keep in mind that it is designed to meet the needs of the emerging IoT and Industry 4.0 applications. Therefore, it is important to ensure that the application environment is compatible with the chip model and that the necessary technologies are supported.


In conclusion, the XCS30XL-3PQG208I chip model is a highly integrated and advanced chip model developed by Xilinx Inc. It is designed to provide a wide range of features and functions for a variety of applications and to support the latest technologies, such as 5G and AI. It has been successfully used in a variety of applications and it is important to ensure that the application environment is compatible with the chip model and that the necessary technologies are supported.



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