XCS30XL-3TQG144C
XCS30XL-3TQG144C ECAD Model
XCS30XL-3TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | 30000 EQUIVALENT GATES AVAILABLE | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30XL-3TQG144C Datasheet Download
XCS30XL-3TQG144C Overview
The XCS30XL-3TQG144C chip model is an advanced integrated circuit that is designed to offer a wide range of features and benefits to its users. Developed and manufactured by Xilinx, the XCS30XL-3TQG144C is a high-performance, low-power, low-cost solution for various applications. It is suitable for a variety of applications such as industrial control, automotive, medical, and consumer electronics.
The XCS30XL-3TQG144C chip model is equipped with a range of features that make it an ideal choice for many applications. It is designed to provide high-speed performance, low-power consumption, and high reliability. It also offers a wide range of memory, storage, and communication options that make it suitable for a variety of applications. Additionally, it is designed to be highly scalable and customizable, making it an ideal solution for future upgrades and applications.
The XCS30XL-3TQG144C chip model is expected to experience increasing demand in the future, particularly in the areas of network and communication systems. This is due to its ability to provide high-speed performance, low-power consumption, and high reliability. Additionally, its scalability and customizability make it an ideal choice for future upgrades and applications. It is also expected to be used in the era of fully intelligent systems, as it is capable of providing the necessary processing power and memory for such advanced applications.
The XCS30XL-3TQG144C chip model is designed to be used in a variety of intelligent scenarios, such as robotics, autonomous vehicles, and smart home systems. It is also suitable for use in networks, as it is capable of providing high-speed performance, low-power consumption, and high reliability. Additionally, its scalability and customizability make it an ideal choice for future upgrades and applications.
In conclusion, the XCS30XL-3TQG144C chip model is an advanced integrated circuit that is designed to provide a wide range of features and benefits to its users. It is expected to experience increasing demand in the future, particularly in the areas of network and communication systems. Additionally, it is designed to be highly scalable and customizable, making it an ideal solution for future upgrades and applications. It is also suitable for use in networks, as it is capable of providing high-speed performance, low-power consumption, and high reliability. Finally, its scalability and customizability make it an ideal choice for use in a variety of intelligent scenarios.
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|---|---|---|
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