XCS30XL-3VQG100C
XCS30XL-3VQG100C ECAD Model
XCS30XL-3VQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 576 CLBS, 10000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30XL-3VQG100C Datasheet Download
XCS30XL-3VQG100C Overview
Xilinx's XCS30XL-3VQG100C chip model is a powerful, versatile solution for a wide range of applications. It is a field-programmable gate array (FPGA) that provides the ideal combination of flexibility and performance. This model is designed to meet the needs of a wide variety of applications, ranging from communication systems to industrial control systems.
The XCS30XL-3VQG100C chip model has several advantages, including its low power consumption, high performance, and scalability. It is designed with the latest technology, making it suitable for a wide range of applications. The chip model also offers a great deal of flexibility, allowing users to customize the design of their system to meet their specific needs. Additionally, the chip model is designed to be compatible with a variety of communication systems, making it a great choice for advanced communication systems.
The XCS30XL-3VQG100C chip model is a great solution for a wide range of applications. It offers a high degree of flexibility, allowing users to customize the design of their systems to meet their specific needs. Additionally, the chip model is designed to be compatible with a variety of communication systems, making it a great choice for advanced communication systems.
The XCS30XL-3VQG100C chip model is designed with the latest technology, making it suitable for a wide range of applications. The chip model has a low power consumption, high performance, and scalability. Additionally, it is designed to be compatible with a variety of communication systems, making it a great choice for advanced communication systems.
The demand for the XCS30XL-3VQG100C chip model is expected to increase in the future as more applications require the flexibility and performance of this chip model. Additionally, the chip model can be upgraded to meet the needs of more advanced applications, making it a great choice for future applications.
The product description and specific design requirements of the XCS30XL-3VQG100C chip model include the following features: it is a field-programmable gate array (FPGA) with low power consumption, high performance, and scalability; it is designed to be compatible with a variety of communication systems; and it has a great deal of flexibility, allowing users to customize the design of their system to meet their specific needs.
In addition to the product description and design requirements, there are several precautions users should take when using the XCS30XL-3VQG100C chip model. For example, users should make sure the chip model is compatible with their system before purchasing it. Additionally, users should consult the manufacturer's documentation to ensure they are using the chip model correctly.
The XCS30XL-3VQG100C chip model is a great solution for a wide range of applications. It offers a high degree of flexibility, allowing users to customize the design of their systems to meet their specific needs. Additionally, the chip model is designed to be compatible with a variety of communication systems, making it a great choice for advanced communication systems. The demand for this chip model is expected to increase in the future as more applications require the flexibility and performance of this chip model. Additionally, the chip model can be upgraded to meet the needs of more advanced applications, making it a great choice for future applications.
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