XCS30XL-4BGG256C
XCS30XL-4BGG256C ECAD Model
XCS30XL-4BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 217 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCS30XL-4BGG256C Datasheet Download
XCS30XL-4BGG256C Overview
The chip model XCS30XL-4BGG256C has been a popular choice for many applications, including advanced communication systems, the development and popularization of future intelligent robots, and more. Manufactured by Xilinx, this model is a low-power, high-performance programmable logic device. It is designed to provide the flexibility to meet the needs of a variety of applications.
In terms of industry trends, XCS30XL-4BGG256C is becoming increasingly popular due to its ability to provide reliable and cost-effective solutions for a variety of applications. As technology advances, the model is being upgraded to meet the needs of new applications and technologies. For example, it is now capable of providing support for high-speed data communication and the development of autonomous robots.
Regarding the original design intention of XCS30XL-4BGG256C, the model was designed to meet the needs of a variety of applications, including high-speed data communication, autonomous robots, and more. The model also provides support for a variety of technologies, such as artificial intelligence, machine learning, and more. With its wide range of features, the model is capable of meeting the needs of many different applications.
When it comes to the application environment, XCS30XL-4BGG256C can be used for a variety of applications, including advanced communication systems, the development and popularization of future intelligent robots, and more. In order to use the model effectively, technical talents, such as software engineers, hardware engineers, and more, are needed.
In conclusion, the chip model XCS30XL-4BGG256C is an excellent choice for a variety of applications. It is designed to provide the flexibility to meet the needs of a variety of applications, and it is becoming increasingly popular due to its ability to provide reliable and cost-effective solutions. With its wide range of features, the model is capable of meeting the needs of many different applications, and technical talents are needed in order to use the model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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