XCS30XL-5BGG256C
XCS30XL-5BGG256C ECAD Model
XCS30XL-5BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCS30XL-5BGG256C Datasheet Download
XCS30XL-5BGG256C Overview
The chip model XCS30XL-5BGG256C is a cutting-edge product in the field of integrated circuit systems. It is designed to provide high-performance, low-power, and cost-effective solutions for the most demanding applications. It is the perfect choice for embedded systems, communication systems, and other high-tech applications.
The XCS30XL-5BGG256C is based on an innovative architecture that combines high speed, low power consumption, and a wide range of features. It is designed to provide a powerful yet cost-effective solution for various applications. The chip is capable of supporting multiple protocol layers, including Ethernet, USB, and Wi-Fi. It also supports advanced features such as high-level encryption and secure boot.
The XCS30XL-5BGG256C is designed to be highly reliable and robust. It is designed to be compatible with a wide range of operating systems and platforms, including Windows, Linux, and Mac OS. It also supports a wide range of communication protocols, including TCP/IP, UDP, and ICMP. The chip also supports advanced features such as Quality of Service (QoS) and Quality of Protection (QoP).
The XCS30XL-5BGG256C is designed to be highly versatile and flexible. It is capable of supporting various applications, including industrial, consumer, and medical applications. It can also be used in a wide range of communication systems, such as cellular networks, wireless networks, and satellite networks.
The XCS30XL-5BGG256C is designed to be highly efficient and cost-effective. It is designed to be compatible with a wide range of development tools, such as C/C++, Java, and Python. It also supports a wide range of communication protocols, including Ethernet, USB, and Wi-Fi. It is also designed to be compatible with a wide range of operating systems and platforms, including Windows, Linux, and Mac OS.
In terms of industry trends, the XCS30XL-5BGG256C is a cutting-edge product that is designed to meet the most demanding applications. It is designed to provide high-performance, low-power, and cost-effective solutions for the most demanding applications. It is the perfect choice for embedded systems, communication systems, and other high-tech applications.
In terms of future development, the XCS30XL-5BGG256C is designed to be upgradeable and flexible. It is designed to be compatible with a wide range of development tools, such as C/C++, Java, and Python. It is also designed to be compatible with a wide range of communication protocols, including Ethernet, USB, and Wi-Fi. It is also designed to be compatible with a wide range of operating systems and platforms, including Windows, Linux, and Mac OS.
In terms of application environment, the XCS30XL-5BGG256C is designed to be highly reliable and robust. It is designed to be compatible with a wide range of operating systems and platforms, including Windows, Linux, and Mac OS. It also supports a wide range of communication protocols, including TCP/IP, UDP, and ICMP. The chip also supports advanced features such as Quality of Service (QoS) and Quality of Protection (QoP).
In terms of product description, the XCS30XL-5BGG256C is designed to provide high-performance, low-power, and cost-effective solutions for the most demanding applications. It is the perfect choice for embedded systems, communication systems, and other high-tech applications. It is based on an innovative architecture that combines high speed, low power consumption, and a wide range of features. It is designed to be highly reliable and robust, and is capable of supporting multiple protocol layers, including Ethernet, USB, and Wi-Fi.
In terms of actual case studies and precautions, the XCS30XL-5BGG256C is designed to be highly reliable and robust. It is designed to be compatible with a wide range of operating systems and platforms, including Windows, Linux, and Mac OS. It also supports a wide range of communication protocols, including TCP/IP, UDP, and ICMP. The chip also supports advanced features such as Quality of Service (QoS) and Quality of Protection (QoP). It is important to note that the XCS30XL-5BGG256C is designed to be highly efficient and cost-effective, and should be used in applications that require high performance and low power consumption.
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