XCS40-3BG256I
XCS40-3BG256I
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rohs
Xilinx

XCS40-3BG256I


XCS40-3BG256I
F20-XCS40-3BG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

XCS40-3BG256I ECAD Model


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XCS40-3BG256I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 13000
Number of CLBs 784
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 784 CLBS, 13000 GATES
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS40-3BG256I Datasheet Download


XCS40-3BG256I Overview



The XCS40-3BG256I chip model is a high-performance, low-power, reconfigurable device that is designed to handle complex digital signal processing, embedded processing, and image processing tasks. It is suitable for a wide range of applications, such as industrial automation, medical imaging, and consumer electronics.


The XCS40-3BG256I chip model is built on a Xilinx Spartan-3E FPGA architecture and is configured with 256 logic cells, 256Kbits of RAM, and 16Kbits of distributed RAM. It is programmed using the HDL (Hardware Description Language) language. The HDL language allows for the creation of complex digital designs that can be easily configured and reconfigured to meet the needs of the user.


The XCS40-3BG256I chip model is a highly versatile and cost-effective solution for many applications. It is capable of performing complex tasks such as image processing and embedded processing at high speeds, making it ideal for a variety of applications. Additionally, the XCS40-3BG256I chip model is also capable of being configured to support new technologies, allowing it to be used in a wide range of applications.


In terms of industry trends, the XCS40-3BG256I chip model is becoming increasingly popular in a wide range of industries, including industrial automation, medical imaging, and consumer electronics. This is due to its versatility, cost-effectiveness, and ability to support new technologies. Additionally, the chip model is becoming increasingly popular in embedded systems due to its low power consumption and high performance.


When designing with the XCS40-3BG256I chip model, it is important to understand the product specifications, design requirements, and actual case studies. Additionally, it is important to pay attention to the power requirements, timing constraints, and other design considerations. It is also important to ensure that the design meets the requirements of the application and that the design is optimized for the intended use.


In conclusion, the XCS40-3BG256I chip model is a highly versatile and cost-effective solution for many applications. It is capable of performing complex tasks such as image processing and embedded processing at high speeds, making it ideal for a variety of applications. Additionally, the XCS40-3BG256I chip model is also capable of being configured to support new technologies, allowing it to be used in a wide range of applications. It is important to understand the product specifications, design requirements, and actual case studies when designing with the XCS40-3BG256I chip model. Additionally, it is important to pay attention to the power requirements, timing constraints, and other design considerations to ensure that the design meets the requirements of the application and that the design is optimized for the intended use.



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