XCS40-3BG256I
XCS40-3BG256I ECAD Model
XCS40-3BG256I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 13000 | |
Number of CLBs | 784 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Organization | 784 CLBS, 13000 GATES | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS40-3BG256I Datasheet Download
XCS40-3BG256I Overview
The XCS40-3BG256I chip model is a high-performance, low-power, reconfigurable device that is designed to handle complex digital signal processing, embedded processing, and image processing tasks. It is suitable for a wide range of applications, such as industrial automation, medical imaging, and consumer electronics.
The XCS40-3BG256I chip model is built on a Xilinx Spartan-3E FPGA architecture and is configured with 256 logic cells, 256Kbits of RAM, and 16Kbits of distributed RAM. It is programmed using the HDL (Hardware Description Language) language. The HDL language allows for the creation of complex digital designs that can be easily configured and reconfigured to meet the needs of the user.
The XCS40-3BG256I chip model is a highly versatile and cost-effective solution for many applications. It is capable of performing complex tasks such as image processing and embedded processing at high speeds, making it ideal for a variety of applications. Additionally, the XCS40-3BG256I chip model is also capable of being configured to support new technologies, allowing it to be used in a wide range of applications.
In terms of industry trends, the XCS40-3BG256I chip model is becoming increasingly popular in a wide range of industries, including industrial automation, medical imaging, and consumer electronics. This is due to its versatility, cost-effectiveness, and ability to support new technologies. Additionally, the chip model is becoming increasingly popular in embedded systems due to its low power consumption and high performance.
When designing with the XCS40-3BG256I chip model, it is important to understand the product specifications, design requirements, and actual case studies. Additionally, it is important to pay attention to the power requirements, timing constraints, and other design considerations. It is also important to ensure that the design meets the requirements of the application and that the design is optimized for the intended use.
In conclusion, the XCS40-3BG256I chip model is a highly versatile and cost-effective solution for many applications. It is capable of performing complex tasks such as image processing and embedded processing at high speeds, making it ideal for a variety of applications. Additionally, the XCS40-3BG256I chip model is also capable of being configured to support new technologies, allowing it to be used in a wide range of applications. It is important to understand the product specifications, design requirements, and actual case studies when designing with the XCS40-3BG256I chip model. Additionally, it is important to pay attention to the power requirements, timing constraints, and other design considerations to ensure that the design meets the requirements of the application and that the design is optimized for the intended use.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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