XCS40XL-3PQG208C
XCS40XL-3PQG208C ECAD Model
XCS40XL-3PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 13000 | |
| Number of CLBs | 784 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 784 CLBS, 13000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS40XL-3PQG208C Datasheet Download
XCS40XL-3PQG208C Overview
The XCS40XL-3PQG208C chip model is a high-performance, low-power, and cost-effective FPGA (Field Programmable Gate Array) designed for a wide range of applications. It is a 3.3V FPGA with a maximum capacity of 208K logic elements, and is suitable for high-speed data processing and communication systems.
The original design intention of the XCS40XL-3PQG208C chip model was to provide a cost-effective solution for embedded systems and applications that require high-speed data processing and communication. It is capable of handling a wide range of tasks, including image processing, signal processing, and data communication. It is also suitable for use in industrial automation, automotive, and medical applications.
The XCS40XL-3PQG208C chip model has the potential to be upgraded in the future to meet more advanced communication systems. It has a wide range of features, including a high-speed transceiver, high-speed I/O, and high-speed memory interface, which are all suitable for use in next-generation communication systems. It is also capable of supporting a variety of intelligent scenarios, such as autonomous driving, facial recognition, and natural language processing.
The product description of the XCS40XL-3PQG208C chip model includes its features, such as its high-speed transceiver, high-speed I/O, and high-speed memory interface. It also includes the power requirements and the maximum capacity of 208K logic elements. Additionally, there are several case studies and precautions to consider when using the chip model. For example, the chip model is not suitable for use in high-temperature or high-humidity environments, and it is important to ensure that the power supply is stable and within the specified voltage range.
In conclusion, the XCS40XL-3PQG208C chip model is a high-performance, low-power, and cost-effective FPGA that is suitable for a wide range of applications. It has the potential to be upgraded to meet more advanced communication systems, and can be used in a variety of intelligent scenarios. It is important to consider the product description and specific design requirements, as well as the actual case studies and precautions when using the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||