XCS40XL-4BGG256C
XCS40XL-4BGG256C
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rohs
Xilinx

XCS40XL-4BGG256C


XCS40XL-4BGG256C
F20-XCS40XL-4BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-256
PLASTIC, BGA-256

XCS40XL-4BGG256C ECAD Model


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XCS40XL-4BGG256C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 205
Number of Outputs 205
Number of Logic Cells 1862
Number of Equivalent Gates 13000
Number of CLBs 784
Combinatorial Delay of a CLB-Max 1.1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 784 CLBS, 13000 GATES
Additional Feature MAXIMUM USABLE GATES 40000
Clock Frequency-Max 217 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-256
Pin Count 256
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XCS40XL-4BGG256C Datasheet Download


XCS40XL-4BGG256C Overview



The Xilinx XCS40XL-4BGG256C chip model is a high-performance digital signal processor (DSP) specifically designed for embedded processing, image processing, and other related applications. It is a powerful and efficient FPGA (Field Programmable Gate Array) which allows users to create custom logic designs using the HDL (Hardware Description Language) language. This makes it an ideal choice for applications requiring high-performance digital signal processing.


The XCS40XL-4BGG256C chip model offers numerous advantages over other DSPs, including its low power consumption, high speed, and scalability. This makes it an attractive choice for a wide range of applications, including those in the automotive, aerospace, and industrial sectors. Moreover, the XCS40XL-4BGG256C chip model is compatible with various development tools, making it easier for developers to create and deploy their designs quickly.


In the near future, the demand for the XCS40XL-4BGG256C chip model is expected to increase as more applications are developed for it. As the technology advances, the chip model will be able to offer more features and capabilities, allowing it to be applied to a wider range of applications. For instance, the XCS40XL-4BGG256C chip model may be used in networks for applications such as data transmission, storage, and security. It may also be used in intelligent scenarios, such as autonomous vehicles, robotics, and artificial intelligence.


The XCS40XL-4BGG256C chip model is also well-suited for use in the era of fully intelligent systems. With its powerful processing capabilities, it can be used to create sophisticated systems that can detect and respond to their environment. This could allow for a wide range of applications, such as autonomous navigation, facial recognition, and natural language processing.


In conclusion, the Xilinx XCS40XL-4BGG256C chip model is a powerful and efficient FPGA that is well-suited for a wide range of applications. It has numerous advantages over other DSPs, including its low power consumption, high speed, and scalability. As the technology advances, the demand for the XCS40XL-4BGG256C chip model is expected to increase, allowing for its use in networks, intelligent scenarios, and the era of fully intelligent systems.



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