XCS40XL-4BGG256I
XCS40XL-4BGG256I ECAD Model
XCS40XL-4BGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 205 | |
| Number of Outputs | 205 | |
| Number of Logic Cells | 1862 | |
| Number of Equivalent Gates | 13000 | |
| Number of CLBs | 784 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 784 CLBS, 13000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 40000 | |
| Clock Frequency-Max | 217 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCS40XL-4BGG256I Datasheet Download
XCS40XL-4BGG256I Overview
The XCS40XL-4BGG256I chip model is a high-performance, low-power field-programmable gate array (FPGA) designed for advanced communication systems. It is based on the Xilinx Spartan-6 FPGA architecture and features 256 I/O pins, 4,096 logic cells, and up to 64 Kbits of RAM. It also supports up to eight 3.3V I/O standards, including LVTTL, LVCMOS, and PCI Express.
The original design intention of the XCS40XL-4BGG256I was to provide a cost-effective and reliable solution for advanced communication systems. It is capable of meeting the most demanding requirements in terms of performance and power consumption. Moreover, the XCS40XL-4BGG256I has the potential to be upgraded in the future to meet more advanced applications.
The XCS40XL-4BGG256I chip model is especially suitable for use in networks. It can be used to create intelligent scenarios, such as distributed control systems, machine learning, and artificial intelligence. It is also suitable for use in the era of fully intelligent systems, such as the Internet of Things (IoT).
When it comes to product description and specific design requirements of the XCS40XL-4BGG256I, it is essential to understand the features and capabilities of the chip. It is also important to be aware of the power consumption, signal integrity, and reliability of the product. Additionally, it is important to consider the actual case studies and precautions when using the chip in a real-world application.
In conclusion, the XCS40XL-4BGG256I chip model is a reliable and cost-effective solution for advanced communication systems. It has the potential to be upgraded in the future and is suitable for use in networks and the era of fully intelligent systems. When it comes to product description and design requirements, it is important to understand the features and capabilities of the chip, as well as the power consumption, signal integrity, and reliability of the product. Additionally, actual case studies and precautions should be considered when using the chip in a real-world application.
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|---|---|---|
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