XCV812E-6BG560C
XCV812E-6BG560C
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Xilinx

XCV812E-6BG560C


XCV812E-6BG560C
F20-XCV812E-6BG560C
Active
IC FPGA 404 I/O 560MBGA
560-MBGA (42.5x42.5)

XCV812E-6BG560C ECAD Model


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XCV812E-6BG560C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E EM
Package Tray
Number of LABs/CLBs 4704
Number of Logic Elements/Cells 21168
Total RAM Bits 1146880
Number of I/O 404
Number of Gates 254016
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)
Base Product Number XCV812E

XCV812E-6BG560C Datasheet Download


XCV812E-6BG560C Overview



The XCV812E-6BG560C is an integrated circuit (IC) chip model manufactured by Xilinx. It is a field programmable gate array (FPGA) device, which is a type of integrated circuit that can be reprogrammed to perform different functions. The XCV812E-6BG560C has a total of 812 logic cells and 6,560 flip-flops, and is based on the Virtex-6 FPGA architecture. It offers a wide range of features, including a high-performance processing system, a large number of configurable I/O pins, and advanced logic functions.


The XCV812E-6BG560C is designed to be used in a wide variety of applications, including embedded systems, digital signal processing, industrial automation, and medical imaging. It is capable of providing high-speed data processing and can be used to develop high-performance, low-power solutions. The device is also designed to be used in high-bandwidth applications, such as video streaming, image processing, and communication systems.


The XCV812E-6BG560C has a wide range of features that make it suitable for a variety of applications. It offers a high-speed, low-power processing system, a wide range of configurable I/O pins, and advanced logic functions. It also has an integrated memory controller, a high-speed serial interface, and a wide range of power management features. The device is designed to be used in a wide range of applications, including embedded systems, digital signal processing, industrial automation, and medical imaging.



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