XCV812E-8BG560C

The XCV812E-8BG560C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Virtex-8 FPGA family and is a high-performance, low-cost solution for a variety of applications.

The XCV812E-8BG560C has an operating temperature range of -40°C to +85°C and a total power dissipation of 8.6 W. It has 8.5 million system gates, 5.6 million logic cells and 1,000 DSP slices. It has 4,096 Kbits of embedded memory and supports up to 8 hard IP cores. The device also features a total of 8 banks of I/O ports, with each bank having up to 56 I/O pins.

The XCV812E-8BG560C is suitable for a wide range of applications, including high-speed data acquisition and signal processing, embedded vision systems, industrial automation, automotive and aerospace applications, and high-performance computing. It is also suitable for applications requiring high-speed serial transceivers, such as 10/100/1000 Ethernet, PCI Express, and USB 3.0.

In summary, the XCV812E-8BG560C is a powerful, low-cost FPGA chip that is suitable for a wide range of applications. It features 8.5 million system gates, 5.6 million logic cells, 1,000 DSP slices, 4,096 Kbits of embedded memory and up to 8 hard IP cores. It is suitable for high-speed data acquisition and signal processing, embedded vision systems, industrial automation, automotive and aerospace applications, and high-performance computing.