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1760-FCBGA (42.5x42.5)


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XCZU17EG-1FFVD1760E Attributes

Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU17EG-1FFVD1760E Datasheet Download

XCZU17EG-1FFVD1760E Overview

The XCZU17EG-1FFVD1760E chip model is a new and innovative product from Xilinx, a leading provider of programmable logic solutions. This chip model is designed to provide high-performance, low-power, and cost-effective solutions for advanced communication systems. It is ideal for applications such as high-speed networks, wireless communications, and industrial automation.

The XCZU17EG-1FFVD1760E chip model is equipped with an FPGA core, which is the main component of the chip model. This FPGA core is designed to be highly configurable and can be used to implement various functions. It has a wide range of features, including a high-speed DDR4 memory interface, a high-speed Ethernet interface, a high-speed PCIe interface, and a high-speed USB 3.0 interface.

The XCZU17EG-1FFVD1760E chip model is designed to be highly flexible and can be used in a variety of applications, including data processing, image processing, and signal processing. It can also be used in the era of fully intelligent systems, as it is capable of supporting advanced machine learning algorithms. In addition, it can be used in a variety of network applications, including wireless networks and 5G networks.

The XCZU17EG-1FFVD1760E chip model is designed to meet the needs of modern communication systems. It is equipped with a powerful FPGA core, which allows for high performance and low power consumption. In addition, it is designed to be highly reliable and can be used in a variety of applications. Furthermore, it is designed to be highly flexible and can be used in a variety of networks and intelligent scenarios.

To ensure that the XCZU17EG-1FFVD1760E chip model is used correctly, it is important to follow the product description and specific design requirements. It is also important to consider actual case studies and take necessary precautions to ensure that the chip model is used properly. Furthermore, it is important to keep in mind that the chip model is designed for advanced communication systems and is not necessarily suitable for all applications. With the right design and implementation, the XCZU17EG-1FFVD1760E chip model can be used to create powerful and efficient communication systems.

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Unit Price: $4,922.46
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,922.4600 $4,922.4600
10+ $4,824.0108 $48,240.1080
100+ $4,725.5616 $472,556.1600
500+ $4,676.3370 $2,338,168.5000
1000+ $4,577.8878 $4,577,887.8000
The price is for reference only, please refer to the actual quotation!

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