|Part Life Cycle Code||Active|
|Supply Voltage-Nom||850 mV|
|uPs/uCs/Peripheral ICs Type||MICROPROCESSOR CIRCUIT|
|Supply Voltage-Max||876 mV|
|Supply Voltage-Min||825 mV|
|Moisture Sensitivity Level||4|
|Operating Temperature-Max||100 °C|
|Peak Reflow Temperature (Cel)||245|
|Time@Peak Reflow Temperature-Max (s)||30|
|Number of Terminals||1760|
|Package Body Material||PLASTIC/EPOXY|
|Package Style||GRID ARRAY|
|Terminal Finish||Tin/Silver/Copper (Sn/Ag/Cu)|
|Ihs Manufacturer||XILINX INC|
|Package Description||BGA, BGA1760,42X42,40|
|Reach Compliance Code||compliant|
XCZU17EG-1FFVD1760E Datasheet Download
The XCZU17EG-1FFVD1760E chip model is a new and innovative product from Xilinx, a leading provider of programmable logic solutions. This chip model is designed to provide high-performance, low-power, and cost-effective solutions for advanced communication systems. It is ideal for applications such as high-speed networks, wireless communications, and industrial automation.
The XCZU17EG-1FFVD1760E chip model is equipped with an FPGA core, which is the main component of the chip model. This FPGA core is designed to be highly configurable and can be used to implement various functions. It has a wide range of features, including a high-speed DDR4 memory interface, a high-speed Ethernet interface, a high-speed PCIe interface, and a high-speed USB 3.0 interface.
The XCZU17EG-1FFVD1760E chip model is designed to be highly flexible and can be used in a variety of applications, including data processing, image processing, and signal processing. It can also be used in the era of fully intelligent systems, as it is capable of supporting advanced machine learning algorithms. In addition, it can be used in a variety of network applications, including wireless networks and 5G networks.
The XCZU17EG-1FFVD1760E chip model is designed to meet the needs of modern communication systems. It is equipped with a powerful FPGA core, which allows for high performance and low power consumption. In addition, it is designed to be highly reliable and can be used in a variety of applications. Furthermore, it is designed to be highly flexible and can be used in a variety of networks and intelligent scenarios.
To ensure that the XCZU17EG-1FFVD1760E chip model is used correctly, it is important to follow the product description and specific design requirements. It is also important to consider actual case studies and take necessary precautions to ensure that the chip model is used properly. Furthermore, it is important to keep in mind that the chip model is designed for advanced communication systems and is not necessarily suitable for all applications. With the right design and implementation, the XCZU17EG-1FFVD1760E chip model can be used to create powerful and efficient communication systems.
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