XCZU17EG-1FFVD1760I
XCZU17EG-1FFVD1760I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
AMD Xilinx

XCZU17EG-1FFVD1760I


XCZU17EG-1FFVD1760I
F20-XCZU17EG-1FFVD1760I
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU17EG-1FFVD1760I ECAD Model


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XCZU17EG-1FFVD1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU17EG-1FFVD1760I Datasheet Download


XCZU17EG-1FFVD1760I Overview



The XCZU17EG-1FFVD1760I chip model is a powerful and versatile processor that is suitable for a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing, and it requires the use of HDL language. It is designed with scalability and flexibility in mind, allowing for future upgrades and modifications.


The XCZU17EG-1FFVD1760I chip model is designed to provide high performance and low power consumption, making it suitable for advanced communication systems. It features a dual-core ARM Cortex-A53 processor, a Mali-400 MP2 graphics processor, and a H.264/H.265 video encoder. It also supports DDR4 RAM, eMMC, and PCIe interfaces.


The product description and specific design requirements of the XCZU17EG-1FFVD1760I chip model are detailed in the product documentation. It is important to follow the instructions in the documentation to ensure that the chip is properly installed and configured. Additionally, some case studies and examples of the chip model in use can be found online.


When designing with the XCZU17EG-1FFVD1760I chip model, there are a few precautions to keep in mind. For example, the chip should not be exposed to high temperatures or humidity, and the power supply should not be overloaded. Additionally, proper grounding techniques should be used to ensure that the chip is properly protected from electrical interference.


Overall, the XCZU17EG-1FFVD1760I chip model is a powerful and versatile processor that is suitable for a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing, and it requires the use of HDL language. With its scalability and flexibility, it can be applied to advanced communication systems, and it is important to follow the instructions in the product documentation and take the necessary precautions when designing with this chip model.



3,051 In Stock


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Unit Price: $4,922.952
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,578.3454 $4,578.3454
10+ $4,529.1158 $45,291.1584
100+ $4,282.9682 $428,296.8240
1000+ $4,036.8206 $2,018,410.3200
10000+ $3,692.2140 $3,692,214.0000
The price is for reference only, please refer to the actual quotation!

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