

XCZU17EG-2FFVB1517E
XCZU17EG-2FFVB1517E ECAD Model
XCZU17EG-2FFVB1517E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | XILINX | |
Date Of Intro | 2018-03-09 |
XCZU17EG-2FFVB1517E Datasheet Download
XCZU17EG-2FFVB1517E Overview
The XCZU17EG-2FFVB1517E is a new chip model that has been recently released by Xilinx, a leading company in the field of programmable logic devices. This chip model is designed to provide a high performance, low power, and cost-effective solution for a variety of applications. It is based on the latest Xilinx UltraScale+ FPGA architecture and is ideal for high-performance computing and networking applications.
The XCZU17EG-2FFVB1517E offers a wide range of features and benefits that make it an attractive option for a variety of applications. It offers a high-performance, low-power, and cost-effective solution for a variety of applications. It has a large capacity of up to 1.2 million logic cells, a high-speed transceiver, and a wide range of I/O pins. It also offers a high-performance DSP block and a wide range of dedicated IP cores. This makes it an ideal choice for a variety of applications including video processing, image processing, signal processing, and communications.
The XCZU17EG-2FFVB1517E is expected to be in high demand in the future as it offers a high performance, low-power, and cost-effective solution for a variety of applications. It is expected to be used in a variety of applications such as 5G wireless communication, industrial automation, data centers, and artificial intelligence. It is also expected to be used in advanced communication systems such as the Internet of Things (IoT), autonomous vehicles, and smart cities.
In terms of future upgrades, the XCZU17EG-2FFVB1517E is designed to be upgradable and can be adapted to new technologies and applications. This makes it an ideal choice for a variety of applications and is expected to be used in many advanced communication systems in the future. It is also expected to be used in networks and intelligent scenarios, such as 5G wireless communication, autonomous vehicles, and smart cities. It is also expected to be used in the fully intelligent systems of the future, such as the Internet of Things (IoT) and artificial intelligence.
Overall, the XCZU17EG-2FFVB1517E is a powerful and cost-effective chip model that is expected to be in high demand in the future. It offers a wide range of features and benefits that make it an attractive option for a variety of applications. It is also designed to be upgradable and can be adapted to new technologies and applications. This makes it an ideal choice for a variety of applications and is expected to be used in many advanced communication systems in the future.
You May Also Be Interested In
2,640 In Stock
Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,181.9900 | $5,181.9900 |
10+ | $5,078.3502 | $50,783.5020 |
100+ | $4,974.7104 | $497,471.0400 |
500+ | $4,922.8905 | $2,461,445.2500 |
1000+ | $4,819.2507 | $4,819,250.7000 |
The price is for reference only, please refer to the actual quotation! |