XCZU17EG-2FFVB1517E
XCZU17EG-2FFVB1517E
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rohs
Xilinx

XCZU17EG-2FFVB1517E


XCZU17EG-2FFVB1517E
F20-XCZU17EG-2FFVB1517E
Active
IC SOC CORTEX-A53 1517FCBGA
1517-FCBGA (40x40)

XCZU17EG-2FFVB1517E ECAD Model


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XCZU17EG-2FFVB1517E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX
Date Of Intro 2018-03-09

XCZU17EG-2FFVB1517E Datasheet Download


XCZU17EG-2FFVB1517E Overview



The XCZU17EG-2FFVB1517E is a new chip model that has been recently released by Xilinx, a leading company in the field of programmable logic devices. This chip model is designed to provide a high performance, low power, and cost-effective solution for a variety of applications. It is based on the latest Xilinx UltraScale+ FPGA architecture and is ideal for high-performance computing and networking applications.


The XCZU17EG-2FFVB1517E offers a wide range of features and benefits that make it an attractive option for a variety of applications. It offers a high-performance, low-power, and cost-effective solution for a variety of applications. It has a large capacity of up to 1.2 million logic cells, a high-speed transceiver, and a wide range of I/O pins. It also offers a high-performance DSP block and a wide range of dedicated IP cores. This makes it an ideal choice for a variety of applications including video processing, image processing, signal processing, and communications.


The XCZU17EG-2FFVB1517E is expected to be in high demand in the future as it offers a high performance, low-power, and cost-effective solution for a variety of applications. It is expected to be used in a variety of applications such as 5G wireless communication, industrial automation, data centers, and artificial intelligence. It is also expected to be used in advanced communication systems such as the Internet of Things (IoT), autonomous vehicles, and smart cities.


In terms of future upgrades, the XCZU17EG-2FFVB1517E is designed to be upgradable and can be adapted to new technologies and applications. This makes it an ideal choice for a variety of applications and is expected to be used in many advanced communication systems in the future. It is also expected to be used in networks and intelligent scenarios, such as 5G wireless communication, autonomous vehicles, and smart cities. It is also expected to be used in the fully intelligent systems of the future, such as the Internet of Things (IoT) and artificial intelligence.


Overall, the XCZU17EG-2FFVB1517E is a powerful and cost-effective chip model that is expected to be in high demand in the future. It offers a wide range of features and benefits that make it an attractive option for a variety of applications. It is also designed to be upgradable and can be adapted to new technologies and applications. This makes it an ideal choice for a variety of applications and is expected to be used in many advanced communication systems in the future.



2,640 In Stock


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Unit Price: $5,181.99
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,181.9900 $5,181.9900
10+ $5,078.3502 $50,783.5020
100+ $4,974.7104 $497,471.0400
500+ $4,922.8905 $2,461,445.2500
1000+ $4,819.2507 $4,819,250.7000
The price is for reference only, please refer to the actual quotation!

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